The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

This application provides an adhesive composition. The adhesive composition includes an adhesive matrix and a modified polymer. A main chain of the modified polymer includes a boron-oxygen coordinate bond and/or a bridging boron-oxygen coordinate bond. A terminal group or a side chain of the modified polymer or both include at least one of a hydroxyl group, an acrylate group, and a vinyl group. This application further provides a preparation method of the adhesive composition, an optical adhesive film, a foldable screen using the optical adhesive film, and an electronic device using the optical adhesive film or the foldable screen.

Provided is a heat-conductive sealing member which has high moisture barrier properties, has heat dissipation properties, and is capable of encapsulating an element by a simple method. The heat-conductive sealing member has a metal base material, an insulating layer that is formed on the metal base material, has heat conductivity and contains at least polyimide, and a tacky adhesive layer that is formed on the insulating layer and has heat resistance.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 20 weight percent of the base film.

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3,4,4-biphenyltetracarboxylic acid dianhydride.

The present application relates to a method for manufacturing a foldable backplate film, and according to one aspect of the present invention, a method for manufacturing a foldable backplate film that the foldable backplate film is manufactured by a method of cutting it in a direction from the release film to the protective film upon half-cutting, and then release-changing the release film, whereby by improving a half-cutting process, the foldable backplate does not fall off upon the release film peeling, is provided.

An environment-friendly adhesive composition is provided that includes about 10 to about 70 parts by weight of a tackifying agent base including an acryl-based attaching agent as a raw material, about 5 to about 40 parts by weight of a terpene-based tackiness improver, about 0.5 to about 5 parts by weight of an epoxy-based crosslinking agent, about 5 to about 60 parts by weight of a flame retardant, and a combination thereof, based on 100 parts by weight of a solvent excluding benzene, toluene and xylene (BTX). The flame retardant includes at least one selected from a group consisting of a halogen-based flame retardant, an antimony flame retardant, and a phosphorus-based flame retardant. The adhesive composition and a tape manufactured using the same may be used exclusively in a vehicle industry, and in various electronic industries.

The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.

The present disclosure relates to a pressure sensitive adhesive may include a polyisobutylene-based material, and a peroxide based additive. The pressure sensitive adhesive may have an Adhesive Electrolyte Exposure Peel Force (AEEPF) of at least about 0.5 N/cm.

The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.