An anti-plasma adhesive tape utilized for manufacturing a semiconductor package includes a substrate; and an adhesive layer formed on the substrate, wherein the adhesive layer is selected from a group composed of acrylic adhesive, light-curable resin and photoinitiator. The anti-plasma adhesive tape is attached to a backside of a lead frame of the semiconductor package before a plasma-cleaning process and removed from the lead frame after a molding process. After the anti-plasma adhesive tape is cured by irradiating an energy ray and removed from the lead frame, there is no residual adhesive left on a molding compound of the semiconductor package.

Pressure-sensitive adhesive formulations based on acrylic or rubber adhesives are provided in combination with an aluminum phosphorous salt intumescent flame retardant and a nitrogen containing flame retardant which can act as a blowing agent through thermal decomposition. These flame retardant additives can be incorporated into the adhesive in levels of 10 to 30 percent by weight. These formulations are then placed on a polymeric flame retardant substrate in either a single-sided or double-sided form.

Provided is a pressure-sensitive adhesive tape for a battery outer packaging having the following feature: the shift (adhesive shift) of the tape in its pressure-sensitive adhesive surface and liquid penetration when the tape is subjected to a salt water immersion test are prevented, and hence the tape is useful for the outer packaging of a battery. The pressure-sensitive adhesive tape for a battery outer packaging includes: a base material; and a pressure-sensitive adhesive layer arranged on one surface of the base material, in which: a value calculated from an expression a loss modulus of elasticity (G) of the pressure-sensitive adhesive tape for a battery outer packaging at 70 C.a thickness (mm) of the pressure-sensitive adhesive layer/a thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging is 810.sup.3 Pa or more; a value calculated from an expression a storage modulus of elasticity (G) of the pressure-sensitive adhesive tape for a battery outer packaging at 23 C.the thickness (mm) of the pressure-sensitive adhesive layer/the thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging is 310.sup.5 Pa or less; and a pressure-sensitive adhesive strength of the pressure-sensitive adhesive tape for a battery outer packaging to a stainless-steel plate at 23 C. is 2 N/10 mm or more.

An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100 C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200 C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board.

A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320 C. and a melt flow rate of at least 2 g/10 min measured at 372 C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250 C. and lower by at least 5 C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

A hot-melt adhesive resin composition includes a modified polyolefin in which a functional group is introduced into a polyolefin, a solid phenol resin, and a crosslinking agent, wherein the content of the modified polyolefin is 10 parts by mass or more and 40 parts by mass or less, based on 100 parts by mass of the total of the modified polyolefin and the solid phenol resin, and the modified polyolefin and the crosslinking agent are mixed so that a functional group possessed by the crosslinking agent is more than 1.0 equivalent and 5.0 equivalents or less, based on 1.0 equivalent of a functional group possessed by the modified polyolefin.

An adhesive film with excellent cuttability with respect to both a base layer and a surface layer or layers laminated thereon is provided, without significant formation of adhesive burrs in various shearing processes. The adhesive film includes a support member and an adhesive layer laminated on at least one side of the support member. The adhesive layer has a laminate structure having a base layer made of a resin-based adhesive and laminated on the surface of the support member and a surface layer made of a resin-based adhesive and laminated on the base layer. The base layer is non-directional and has lengthwise and widthwise shearing strengths of 2 g to 2000 g (200 mm/min, 25 mm) in the thickness range of 2 m to 60 m. The base layer has a shearing strength of 1.5 to 200 times the shearing strength of the surface layer.

A poly(amide-imide) copolymer film having a compressive modulus of greater than or equal to about 1.8 gigaPascals and a yellowness index of less than or equal to about 3, when measured according to an ASTM E313 standard.