A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

An adhesive film with excellent cuttability with respect to both a base layer and a surface layer or layers laminated thereon is provided, without significant formation of adhesive burrs in various shearing processes. The adhesive film includes a support member and an adhesive layer laminated on at least one side of the support member. The adhesive layer has a laminate structure having a base layer made of a resin-based adhesive and laminated on the surface of the support member and a surface layer made of a resin-based adhesive and laminated on the base layer. The base layer is non-directional and has lengthwise and widthwise shearing strengths of 2 g to 2000 g [200 mm/min, 25 mm] in the thickness range of 2 μm to 60 μm. The base layer has a shearing strength of 1.5 to 200 times the shearing strength of the surface layer.

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m.sup.2 and a loop stiffness value of 0.45 g/cm or more

A transfer foil for a touch sensor includes a temporary support, a conductive layer, and a layer to be bonded to a support. The peel adhesion between the temporary support and the conductive layer is 0.20 N/mm or less. The layer to be bonded to a support has a thickness of 20 μm or less, and a modulus of elasticity of 0.10 MPa or more at a temperature of 130° C. The conductive layer includes a detection electrode that has a mesh pattern formed of a thin wire consisting of a conductive member and an external connection terminal that consists of a conductive member and is drawn from the detection electrode. The thin wire forming the mesh pattern of the detection electrode has a line width of 1 μm or more and 4.5 μm or less.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Disclosed herein are an adhesive protective film, an optical member including the same, and an optical display including the same. An adhesive protective film is formed of a composition including a (meth)acrylic binder derived from a monomer mixture including: an alkyl group-containing (meth)acrylic monomer; and at least one selected from among a hydroxyl group-containing (meth)acrylic monomer, a carboxyl group-containing (meth)acrylic monomer, and a polysiloxane (meth)acrylate, the adhesive protective film having an initial peel strength of about 100 gf/inch or less and a peel strength decrease rate of about 50% or less, as calculated according to Equation 1.

A back film for a display device and the display device are provided in the present disclosure. The back film includes an opening region and a non-opening region, and the back film includes a first flexible material layer and a polyimide layer laminated one on another. An opening penetrating through the first flexible material layer and the second flexible material layer is formed in the back film, and a region corresponding to the opening is the opening region. The back film further includes a protection member covering the camera region.