Patent classifications
C09K3/1006
CURABLE RESIN COMPOSITION AND SEALING MATERIAL USING SAME
The present invention aims to provide a resin composition containing a cyanate ester compound which can reduce the formation of carbamate compounds so that the resin composition can be suitably used as an sealing material. The present invention relates to a curable resin composition containing a cyanate ester compound and a dehydrating agent.
SIMULATED SEALANT AND TEST PIECE FOR SEALING OPERATION TRAINING
A simulated sealant which comprises a polybutene resin and a polyethylene resin, wherein the polyethylene resin is in a sol state and is dispersed in the polybutene resin.
ELECTROLYTIC CAPACITOR
An electrolytic capacitor includes a capacitor element, a case, and a sealing member. The case has an opening and houses the capacitor element. The sealing member seals the opening. The sealing member includes an elastic member that is fit in the opening. The elastic member includes a polymer component and a particle component. The polymer component includes at least butyl rubber. The particle component includes at least particles of kaolin. An average particle size of the particles of kaolin is less than or equal to 4 m.
Phenylhydrazine/anhydride adducts and anaerobic curable compositions using same
Phenylhydrazine/anhydride adducts and anaerobic curable compositions using these adducts are provided. The compositions are particularly useful as adhesives and sealants.
Epoxy resin molding material for sealing and electronic component device
An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound.
Seal ring
It is an object of the present invention to provide a seal ring which has small oil leak and low torque generation performance for improving fuel consumption in a favorable balance as originally intended by the present invention. A seal ring (1) is mounted on an annular groove formed on one member consisting of either a housing having a shaft hole or a rotary shaft inserted into the shaft hole, contacts a surface of other member consisting of either the housing or the rotary shaft, and slidably contacts a side wall surface of the annular groove at a non-sealed fluid side thereof. V-shaped concave portions (3) which do not contact the side wall surface of the annular groove are formed on at least one portion of an end of an inner diameter side of a side surface (2) of the seal ring (1).
Curable resin composition and sealing material using same
The present invention aims to provide a resin composition containing a cyanate ester compound which can reduce the formation of carbamate compounds so that the resin composition can be suitably used as an sealing material. The present invention relates to a curable resin composition containing a cyanate ester compound and a dehydrating agent.
Photovoltaic thermal collector
A photovoltaic thermal collector is provided with: glasses disposed on both a sunlight receiving surface side and an opposite surface side thereto; a hot-water producing portion and a power generating portion. An olefinic rubber sealing member (A) is disposed on at least one surface side of a power generating element of the power generating portion, and an olefinic rubber sheet (B) including carbon black is disposed on an opposite surface side thereto. In addition, a resin pipe as a channel of the hot-water producing portion is made of cross-linked polyethylene or polybutene; the resin pipe is sandwiched in the olefinic rubber sheet (B); and the olefinic rubber sheet (B) is further disposed in a side portion of the resin pipe and in a gap between one resin pipe and another resin pipe.
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
The present application discloses a die sealant for chip packaging and a packaging structure, wherein epoxy resin adopted in the die sealant has flexible units such as polyether. In combination with the compounding of components such as a curing agent and a diluent, good flexibility and strength are achieved, and warpage is effectively reduced, wherein the warpage can be reduced to 0 mm, the modulus can reach up to 8 GPa or above, good silicon adhesion is achieved, and a silicon wafer can be effectively protected from bending cracks caused by warpage. Moreover, by adding a p-tert-butylphenol epoxy resin diluent, impacts of a monofunctional aliphatic diluent on a curing system can be further reduced effectively, and the flexibility and modulus of the die sealant can be further improved.
Enzymatic self-cleaning sealants
Sealants and caulks (i.e., polymeric fillers) disclosed herein are polymeric fillers that comprises a polymeric material composition and one or more lipolytic enzymes dispersed within the polymeric material composition. In preferred embodiments, the polymeric material composition is an acrylic latex sealant such as that in the form of a caulk and the one or more lipolytic enzymes comprises a lipase such as, preferably, a triacylglycerol lipase. Advantageously, the one or more lipolytic enzymes of such sealants and caulks degrades lipid-containing contaminants and resulting lipid-containing stains that contain lipids. The degradation is a result of the ability of a lipolytic enzyme to catalyze a reaction on a lipid-containing substance (i.e., a substrate) to hydrolyze or move (e.g., intra-esterification) ester bonds of such lipid-containing substance. This lipid-degradation functionality at least partially inhibits the growth of such mold and mildew resulting from exposure to lipid-containing contaminants.