The present invention relates to the use of a carboxylic-acid-containing cleaning agent for removing stains of vegetable origin and/or for decontaminating surfaces contaminated by plant-protection agents. The agent comprises 20-60 wt. % of an aliphatic C.sub.1-C.sub.10 carboxylic acid, preferably formic acid, or a mixture of two or more of such aliphatic carboxylic acids which preferably comprises formic acid, at least one surfactant, preferably an anionic surfactant and/or at least one non-ionic surfactant, and water and/or solvent as the remainder. In another aspect, the present invention relates to specific carboxylic-acid-containing cleaning agents for hard surfaces, which agents are particularly suitable for the intended use.

A tile system for covering a surface. The tile system comprises a first tile assembly connected to a second tile assembly by a connector. Each tile assembly comprises a first tile stacked on a second tile, the first tile and the second tile joined to a reinforcing material disposed therebetween. The connector comprises a first component and a second component that is complementary to the first component. The first component is mounted to the first tile assembly, and the second component is mounted to the second tile assembly.

A solid hard surface cleaning composition suitable for replacing liquid formulations while providing at least equivalent or enhanced cleaning performance, including at lower concentrations, is provided. The solid hard surface cleaning compositions include alkali metal carbonate alkalinity source(s), aminocarboxylic acid chelant(s), amphoteric surfactant(s), polyacrylate polymer(s) and anionic surfactant(s). The solid hard surface cleaning compositions can include additional functional ingredients, such as corrosion inhibitors. The solid hard surface cleaning compositions do not include hydroxide alkalinity and beneficially provide stable ready-to-use formulations that are safe for contact without the use of personal protective equipment (PPE) and are compatible with soft metals.

Compounds, compositions and methods are provided for reducing, inhibiting, or preventing corrosion of a surface, using a polyester polyamine compound. The polyester polyamine compound having a structure corresponding to Formula 1 or 2, or a salt thereof:

##STR00001##

wherein R.sub.1 is independently alkylene; R.sub.2 is independently hydrogen or —COR.sub.4; R.sub.3 is independently alkyl, alkenyl, aryl, or alkaryl; R.sub.4 is independently alkyl or alkenyl; R.sub.10 and R.sub.11 are each independently hydrogen, alkyl, or alkaryl; m is an integer from 1 to 10; n is an integer from 3 to 10; and wherein at least one R.sub.2 is —COR.sub.4.

The invention provides a cleaning agent composition for use in removing an adhesive residue, characterized in that the composition contains a quaternary ammonium salt, a metal corrosion inhibitor, and an organic solvent, and the metal corrosion inhibitor is formed of a C7 to C40 saturated aliphatic hydrocarbon compound monocarboxylic acid, a C7 to C40 saturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride, a C7 to C40 unsaturated aliphatic hydrocarbon compound monocarboxylic acid, or a C7 to C40 unsaturated aliphatic hydrocarbon compound dicarboxylic acid or anhydride.

This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; and 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

An object of the present invention is to provide a cleaning liquid for a semiconductor substrate, which has excellent corrosion prevention performance for a metal-containing layer. In addition, another object of the present invention is to provide a method for cleaning a semiconductor substrate.

The cleaning liquid of an embodiment of the present invention is a cleaning liquid for a semiconductor substrate that has been subjected to a chemical mechanical polishing treatment, in which the cleaning liquid includes a component A having two or more onium structures in a molecule, and water, and has a pH of 7.0 to 11.8 at 25° C.

A photoresist stripping composition comprising an organic amine and a method is provided. The photoresist stripping composition comprising an organic amine having the following formula (1).

##STR00001##

Disclosed are multifunctional compounds represented by structural formula (I):

##STR00001##

methods of producing compounds represented by structural formula (I) and their use in inhibiting corrosion in corrodible material.

A treatment liquid contains water, hydroxylamine, and one or more kinds of hydrazines selected from the group consisting of hydrazine, a hydrazine salt, and a hydrazine derivative, in which a total content of the hydrazines is 1 part by mass or less with respect to 100 parts by mass of the hydroxylamine.