Fabric treatment compositions that include benefit agent capsules and biphenyl brightener. Methods of using the same. Wash water that includes such compositions.

The present disclosure provides a laundry care composition having at least one laundry care ingredient and at least one leuco composition conforming to Formula (I):
Ar.sup.1Ar.sup.2Ar.sup.3CH  (I)
wherein Ar.sup.2 and Ar.sup.3 are independently a carbocyclic aryl or heteroaryl, and Ar.sup.1 is selected from the group consisting of: unsubstituted phenyl, electron deficient carbocyclic aryl, and heteroaryl. The present disclosure also provides a method of determining an authentic laundry care composition and test kits for detecting authentic laundry care compositions.

A semiconductor cleaning agent containing a sulfonic acid group-containing polymer, wherein a content of at least one metal selected from the group consisting of Na, Al, K, Ca and Fe is 0.7 ppm or less.

A semiconductor cleaning agent containing a sulfonic acid group-containing polymer, wherein a content of at least one metal selected from the group consisting of Na, Al, K, Ca and Fe is 0.7 ppm or less.

The present invention provides: a cleaning liquid for semiconductor substrates having undergone CMP, the cleaning liquid being excellent in temporal stability and cleaning performance; and a method of cleaning such semiconductor substrates. A cleaning liquid of the invention contains: a first amine compound which is represented by Formula (1) and whose conjugated acid has a first acidity constant of not less than 8.5; and a second amine compound (provided that the first amine compound is excluded). The mass ratio of the first amine compound content to the second amine compound content is 1 to 100, and the cleaning liquid has pH of 6.0-12.0 at 25° C.

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According to the invention, the compositions and methods provide for the complete removal of labels, synthetic glues and/or adhesives from a plurality of surfaces through the use of an aqueous or non-aqueous basic organic solvent and/or an amidine, optionally in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures and pH conditions, along with under caustic-free and/or reduced caustic conditions to effectively remove such labels, synthetic glues and/or adhesives from a surface within less than about 30 minutes.

Provided are compositions and methods useful in the post-CMP cleaning of microelectronic devices, in particular, devices which contain one or more surfaces comprising hydrophobic carbon or SiC. In general, the compositions comprise a chelating agent; a water-miscible solvent; a reducing agent; and a pH adjustor, wherein the composition has a pH of about 2 to about 13.

Self-invertible inverse latex including as an inverting agent for surfactant species of the alkylpolyglycoside family, the alkyl chain of which includes from 8 to 18 carbon atoms, and use thereof as thickener and/or emulsifier and/or stabilizer for a detergent or cleaning formulation for industrial or household use.

Solid rinse aid compositions, methods of use, and methods of making said composition are disclosed. Rinse aid is provided by a solidification agent, a sheeting agent, a defoamer component, and a polyacrylic acid homopolymer or alkali metal salt thereof forming a solid composition. Preferred solidification agents include aromatic sulfonates. Preferred sheeting agents include one or more alcohol ethoxylates. Preferred defoamer components include a polymer compound including one or more ethylene oxide groups. The solid rinse aid compositions are preferably substantially free of sulfate and sulfate-containing compounds.

Cleaning and degreasing compositions containing a diutan gum thickener are provided for removing burnt on, polymerized, carbonized food soils with minimum manual effort. The compositions are ready to use compositions and beneficially remain on a treated surface for sufficient time to permit soil penetration without drying out. The compositions can be easily removed with minimal manual effort, such as use of low pressure water applied to the treated surface, and beneficially do not leave residues. Methods for cleaning and degreasing a surface with the compositions are also provided. Thickening systems employing the diutan gum and laponite clays are also provided.