C11D7/36

STABLE ANTIFOAMING COMPOSITIONS

A stabilized antifoaming composition having at least three components. The first component is an antifoaming agent. The second component is an ethylene-(meth)acrylic acid copolymer. The third component is a salt.

Liquid composition for removing titanium nitride, semiconductor-element cleaning method using same, and semiconductor-element manufacturing method

This invention provides a liquid composition that removes titanium nitride from a substrate without corroding tungsten or a low-k interlayer dielectric also present on said substrate. Said liquid composition has a pH between 0 and 4, inclusive, and contains the following: at least one oxidizing agent (A) selected from the group consisting of potassium permanganate, ammonium peroxodisulfate, potassium peroxodisulfate, and sodium peroxodisulfate; a fluorine compound (B); and a tungsten-corrosion preventer (C). The tungsten-corrosion preventer (C) either contains at least two different compounds selected from a group of compounds (C1) consisting of alkylamines, salts thereof, fluoroalkylamines, salts thereof, and the like or contains at least one compound selected from said group of compounds (C1) and at least one compound selected from a group of compounds (C2) consisting of polyoxyalkylene alkylamines, polyoxyalkylene fluoroalkylamines, and the like. The mass concentration of potassium permanganate in the abovementioned oxidizing agent (A) is between 0.001% and 0.1%, inclusive, and the mass concentration of the abovementioned fluorine compound (B) is between 0.01% and 1%, inclusive.

Liquid composition for removing titanium nitride, semiconductor-element cleaning method using same, and semiconductor-element manufacturing method

This invention provides a liquid composition that removes titanium nitride from a substrate without corroding tungsten or a low-k interlayer dielectric also present on said substrate. Said liquid composition has a pH between 0 and 4, inclusive, and contains the following: at least one oxidizing agent (A) selected from the group consisting of potassium permanganate, ammonium peroxodisulfate, potassium peroxodisulfate, and sodium peroxodisulfate; a fluorine compound (B); and a tungsten-corrosion preventer (C). The tungsten-corrosion preventer (C) either contains at least two different compounds selected from a group of compounds (C1) consisting of alkylamines, salts thereof, fluoroalkylamines, salts thereof, and the like or contains at least one compound selected from said group of compounds (C1) and at least one compound selected from a group of compounds (C2) consisting of polyoxyalkylene alkylamines, polyoxyalkylene fluoroalkylamines, and the like. The mass concentration of potassium permanganate in the abovementioned oxidizing agent (A) is between 0.001% and 0.1%, inclusive, and the mass concentration of the abovementioned fluorine compound (B) is between 0.01% and 1%, inclusive.

Low alkaline low temperature ware wash detergent for protein removal and reducing scale build-up

Caustic-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, non-caustic source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces and enhance protein removal from the treated surfaces. Beneficially the detergent compositions have a concentrate pH less than about 11.5. The detergent compositions are used with a sanitizer to employ the low alkaline detergent compositions are particularly suitable for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the low alkaline detergent compositions are also provided.

Low alkaline low temperature ware wash detergent for protein removal and reducing scale build-up

Caustic-free detergent compositions are provided. Detergent compositions including an aminocarboxylate, water conditioning agent, non-caustic source of alkalinity and water beneficially do not require the use of additional surfactants and/or polymers to provide suitable detergency and prevent scale build-up on treated surfaces and enhance protein removal from the treated surfaces. Beneficially the detergent compositions have a concentrate pH less than about 11.5. The detergent compositions are used with a sanitizer to employ the low alkaline detergent compositions are particularly suitable for use as low temperature ware wash detergents that beneficially reduce scale build-up. Methods of employing the low alkaline detergent compositions are also provided.

Industrial cleaning systems, including solutions for removing various types of deposits, and cognitive cleaning

A method is used for cleaning heat exchanger systems. The method is performed at a computer system having one or more processors and memory storing one or more programs configured for execution by the one or more processors. The method determines component percentages of a cleaning solution based, at least in part, on operational parameters of a heat exchanger system. The operational parameters include chemical composition of fluids passing through the heat exchanger system and operating temperatures of the fluids passing through the heat exchanger system. The component percentages of the cleaning solution include: (1) hydrogen peroxide, 2-90 wt. %; (2) a complexing agent, 3-30 wt. %; (3) water-soluble calixarene, 0.01-10 wt. %; and (4) water. The complexing agent includes a polybasic organic acid or a sodium salt thereof, or a derivative of phosphorous acid.

STABLE PERCARBOXYLIC ACID COMPOSITIONS AND USES THEREOF

The present invention relates generally to stable percarboxylic acid compositions comprising, inter alia, at least two stabilizing agents, and various uses for water treatments, including water treatments in connection with oil- and gas-field operations. The present invention also relates to slick water compositions and gel based compositions that comprise stable percarboxylic acid compositions and the use thereof in oil- and gas-field operations.

STABLE PERCARBOXYLIC ACID COMPOSITIONS AND USES THEREOF

The present invention relates generally to stable percarboxylic acid compositions comprising, inter alia, at least two stabilizing agents, and various uses for water treatments, including water treatments in connection with oil- and gas-field operations. The present invention also relates to slick water compositions and gel based compositions that comprise stable percarboxylic acid compositions and the use thereof in oil- and gas-field operations.

CONTACT LENS TREATMENT SOLUTION

The present invention is a contact lens treatment solution containing the following copolymer A and copolymer B in a ratio of A/B=40/1 to 5/1 (by weight). According to the present invention, there can be provided a contact lens treatment solution capable of removing dirt having adhered to contact lens surfaces, capable of improving lubricity of contact lens surfaces and capable of imparting persisting hydrophilicity to contact lens surfaces, by simple immersion treatment.

Copolymer A: a copolymer obtained by copolymerization of a monomer (a) represented by formula (1) and a monomer (b) represented by formula (2), in which the copolymerization ratio of the monomer (a) to the monomer (b), a/b=7/3 to 9/1 (by mol), and having a weight-average molecular weight of 400,000 to 800,000.
Copolymer B: a copolymer obtained by copolymerization of a monomer (a) represented by the formula (1) and a monomer (b) represented by the formula (2), in which the copolymerization ratio of the monomer (a) to the monomer (b), a/b=2/1 to 8/1 (by mol), and having a weight-average molecular weight of 1,000,000 to 1,500,000.

CLEANING LIQUID

An object of the present invention is to provide a cleaning liquid for semiconductor substrates with a change in the pH of the cleaning liquid caused by dilution being suppressed. A cleaning liquid of the invention is a cleaning liquid for semiconductor substrates that contains a chelating agent, and an acidity constant (pKa) of the chelating agent and a pH of the cleaning liquid satisfy a condition defined by Formula (A):


pKa−1<pH<pKa+1  (A)