Discussed is a self-assembly apparatus for a plurality of semiconductor light-emitting devices, and a method for self-assembly of the plurality of semiconductor light-emitting devices, whereby the apparatus includes a chamber accommodating the plurality of semiconductor light-emitting devices and a fluid; a transferor to transfer a substrate to an assembly position; a magnet to apply a magnetic force to the plurality of semiconductor light-emitting devices; a position controller to control a position of the magnet; and a vibration generator in contact with the fluid to generate a vibration in the fluid to separate the plurality of semiconductor light-emitting devices from each other while in the fluid, wherein an electric field is produced in the substrate while the plurality of semiconductor light-emitting devices are moved according to a change of the position of the magnet.

Provided are an ink composition, a light-emitting apparatus using the ink composition, and a method of manufacturing the light-emitting apparatus. The ink composition may include a light-emitting device, a solvent, and an organic thickener, and the organic thickener is a polymeric compound including at least one group represented by Formula 1: ##STR00001## wherein in Formula 1, X, R.sub.1, n1, and R.sub.2 may respectively be understood by referring to the descriptions of X, R.sub.1, n1, and R.sub.2 provided in the detailed description.

The present disclosure has an object to hinder reduction of a yield due to a failure in an LED element or a mounting failure in a self light emitting apparatus. In a self light emitting apparatus, each pixel includes one basic cell and at least one redundant cell as a subpixel. The redundant cell includes an LED element that emits light of a color the same as at least one LED element out of LED elements included in the basic cell. A plurality of subpixels included in each pixel are configured as a subpixel group being an assembly that includes a plurality of LED elements being integrated. An array pitch of the subpixels in the subpixel group is smaller than an array pitch of the subpixels in adjacent ones of a plurality of subpixel groups.

Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

An apparatus for manufacturing a display device includes a stage, a first electric field applying module including first probe pins and disposed on a first side of the stage, a light irradiation module including light-emitting elements and disposed on the stage, and a first voltage output module that outputs an emission driving signal that drives the light-emitting elements, outputs a first alignment signal to one of the first probe pins, and outputs a second alignment signal to another one of the first probe pins.

Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

A method of fabricating an LED light plate, an LED light plate, and a display device are disclosed. The method includes: disposing a functional layer on each LED chip to form multiple chips to be transferred; placing the chips into a receiving tank filled with a suspension; defining a plurality of grooves matching the shape of the functional layer in the transport substrate; placing the transport substrate into the suspension so that a first electrode in each receiving tank faces each second electrode in the respective groove and that each chip is located between the first electrode and the respective second electrode; energizing the first electrode and each second electrode, so that each chip is absorbed by the transporting substrate, and each functional layer is moved into the respective groove; and transplanting the multiple chips onto a target substrate; where each functional layer is filled with multiple charged particles.

A mass transfer method for LED lamp beads, including: providing a growth substrate, the growth substrate includes a first substrate and an LED lamp bead array disposed on one surface of the first substrate, LED lamp beads of the LED lamp bead array are connected to the first substrate through a release layer; providing a driver circuit substrate, the driver circuit substrate includes a second substrate and a lamp mount array disposed on one surface of the second substrate, the lamp mount array is matched with the LED lamp bead array; moving the growth substrate to a position above the driver circuit substrate, and rotating the growth substrate and/or the driver circuit substrate so that the LED lamp bead array is aligned with the lamp mount array; and evaporating the release layer and removing the first substrate.

The present disclosure provides a light-emitting substrate. The light-emitting substrate includes a backboard, a light-emitting layer and a plurality of first optical bodies. The light-emitting layer is located on a side of the backboard; the light-emitting layer includes a plurality of light-emitting units, and the plurality of light-emitting units are arranged in an array. Each first optical body includes a first optical portion and a second optical portion; a gap between two adjacent light-emitting units is filled with the first optical portion, and the second optical portion is located on a side of the light-emitting layer away from the backboard, and is connected to the first optical portion. The second optical portion includes a first surface extending outwards from an edge of the first optical portion.

This application discloses a pixel unit for semiconductor device and a manufacturing method, a micro display screen, and a discrete device, the pixel unit includes a target drive circuit, a display unit, and a common cathode, the backplane is provided with a drive circuit, and the drive circuit is provided with at least one anode; the display unit is provided on the backplane, it includes a first device layer and a second device layer stacked vertically from bottom to top, the first device layer and the second device layer are respectively connected to the corresponding anodes of the backplane; the common cathode is respectively connected to each device layer in the display unit, and the common cathode is connected to the external cathode.