The present invention relates to a process for producing a more crispy food product based on multi-layered laminated dough such as croissants and the like, to the tools for making such products and the food products prepared according to this process.

The present invention relates to a process for producing a more crispy food product based on multi-layered laminated dough such as croissants and the like, to the tools for making such products and the food products prepared according to this process.

A dividable dough sheet piece gives consumers enhanced flexibility in creating food items from pre-made sheeted dough. The dividable dough sheet piece is cut from a dough sheet, with the dividable dough sheet piece having a perimeter and including a plurality of interconnected, sub-pieces defined within the perimeter. Each sub-piece is defined by one or more lines of structural weakness that provide predetermined breaking points. The dividable dough sheet piece can be used as a whole or can be divided into the sub-pieces for alternative use.

A dividable dough sheet piece gives consumers enhanced flexibility in creating food items from pre-made sheeted dough. The dividable dough sheet piece is cut from a dough sheet, with the dividable dough sheet piece having a perimeter and including a plurality of interconnected, sub-pieces defined within the perimeter. Each sub-piece is defined by one or more lines of structural weakness that provide predetermined breaking points. The dividable dough sheet piece can be used as a whole or can be divided into the sub-pieces for alternative use.

A bread product is produced by forming a dough piece, creating at least one score in the dough piece, applying an adhesive to the dough piece with the adhesive extending across the score, freezing the dough piece to produce a frozen dough piece, and baking the dough piece, causing the adhesive to melt while establishing a bread product having, in a central region of the bread product, what was once a score held together by the adhesive during the early stages of baking, an internal exposed region. The outlined production steps can be re-arranged, so long as the scoring and adhesive application is performed prior to thawing of the dough piece.

A bread product is produced by forming a dough piece, creating at least one score in the dough piece, applying an adhesive to the dough piece with the adhesive extending across the score, freezing the dough piece to produce a frozen dough piece, and baking the dough piece, causing the adhesive to melt while establishing a bread product having, in a central region of the bread product, what was once a score held together by the adhesive during the early stages of baking, an internal exposed region. The outlined production steps can be re-arranged, so long as the scoring and adhesive application is performed prior to thawing of the dough piece.

An automated cutting die being produced edible biodegradable tableware contains: a cutting assembly, a holding assembly, and edible biodegradable dough. The cutting assembly includes a first cutting mold and a second cutting mold. The first cutting mold has multiple cutting portions, and the second cutting mold has multiple grooves and two first support portions. The holding assembly includes a first receiving mold and a second receiving mold. The first receiving mold has multiple pressing portions, two second support portions formed beside the multiple pressing portions, and multiple through holes defined on the multiple pressing portions, wherein the second receiving mold has a recessed portion defined thereon, a molding cavity formed in a hollow shape beside the recessed portion and multiple passing orifices defined on the molding cavity.

The present disclosure describes an ultrasonic rotary molding system that is used to form edible compositions or food products as they move along a conveyor belt. The food products are formed by an ultrasonic rotary wheel that includes one or more cutting tools that cut, and perhaps three dimensionally mold, food product strips. The system may include a movable backing plate that is located below the point where the ultrasonic rotary wheel cuts the food product strips. The movable backing plate may be spring loaded and it may exert force upwards against the conveyor belt and in turn against the food product.

The present disclosure describes an ultrasonic rotary molding system that is used to form edible compositions or food products as they move along a conveyor belt. The food products are formed by an ultrasonic rotary wheel that includes one or more cutting tools that cut, and perhaps three dimensionally mold, food product strips. The system may include a movable backing plate that is located below the point where the ultrasonic rotary wheel cuts the food product strips. The movable backing plate may be spring loaded and it may exert force upwards against the conveyor belt and in turn against the food product.

The present invention relates to a transshipment device for dough pieces, comprising at least one carrier picking location, for positioning empty carriers to be picked, at least one carrier loading location, for loading a picked carrier with dough pieces, at least one carrier deposition location, for depositing a carrier loaded with dough pieces, a number of movable grippers for picking, moving and depositing carriers, wherein each gripper is individually movable parallel to a common vertical axis in a vertical direction and each gripper is individually movable in a radial direction from the common vertical axis, multiple grippers project in a different radial direction from the common vertical axis, and all grippers are rotatable together and/or simultaneously about the common vertical axis wherein the at least one carrier picking location, the at least one carrier loading location and the at least one carrier deposition location surround the common vertical axis of rotation, a controller, for controlling movement the grippers, in particular each subsequently along the carrier picking location, the carrier loading location and the carrier deposition location.