A crumb is manufactured by a process including adding an aqueous flour mixture into an extruder, partially extruding the aqueous mixture through the extruder, adding an aqueous gelling agent to the extruder at a point downstream of the start of the extrusion of the aqueous mixture through the extruder to form a resultant mixture of the aqueous mixture and the aqueous gelling agent in the extruder, and extruding the resultant mixture at a temperature greater than 100 C. to form an extrudate. The extrudate is allowed to expand, dried and milled to form the crumb, which has moisture-resistant properties particularly well-suited for use on frozen, microwavable food products.

A crumb is manufactured by a process including adding an aqueous flour mixture into an extruder, partially extruding the aqueous mixture through the extruder, adding an aqueous gelling agent to the extruder at a point downstream of the start of the extrusion of the aqueous mixture through the extruder to form a resultant mixture of the aqueous mixture and the aqueous gelling agent in the extruder, and extruding the resultant mixture at a temperature greater than 100 C. to form an extrudate. The extrudate is allowed to expand, dried and milled to form the crumb, which has moisture-resistant properties particularly well-suited for use on frozen, microwavable food products.

A method, apparatus, and/or system for soft defects modeling of measurements using time-domain reflectometry. Electro-Optic Sampling based Time-Domain Reflectometry (EOS-TDR) may quickly detect soft defects in a chip under test. For example, EOS-TDR may detect soft defects in each pin from a trace-structure point at a relatively high resolution. To interpret the results in a time sensitive manner, a reference model for chips may be established from chips that are known to have met the expected quality standards. Through automated analysis of the features of the device under test waveform, soft defects of a chip may be detected that would be otherwise undetectable under time constraints, temperature variations, applied current variations, applied voltage variations, vibration variations, moisture variations, or any other kind of possible variation.