Provided is a microneedle patch which is easily to be applied on a skin surface. One or more holes are provided inside a protective sheet of the microneedle patch, and one or more cutting lines running from an outer edge of the protective sheet toward the holes are also provided. The cutting lines may be symmetrically arranged on both sides of the hole. Providing an incision on the outer edge of the cutting lines of the protective release sheet facilitates cutting along the cutting lines. In the use of the microneedle patch, both sides of the cutting line of the protective release sheet are held and torn so as to bring out a microneedle array adhesive sheet and apply it on a skin. Then the microneedle array surface is slightly compressed, thereby the microneedle is inserted into the stratum corneum.

Methods of handling adhesive laminate patches. A first article, passed over a first supporting structure, includes disconnected adhesive laminate patches adhered to a first web, each patch being aligned over and adhered to a tab. A second web can be passed over a second supporting structure that is separated from the first supporting structure by a gap. The first article can be passed over the first supporting structure to lift a leading portion of a first tab and a first patch off of the first web together, such that the first tab facilitates transfer of the first patch across the gap. The first patch can then be adhered to the second web; and the second web can be advanced to transfer the first patch, and first tab, onto the second web to form a second article comprising patches aligned over tabs on the second web.

Methods and compositions for securing to and removing adhesive tapes from substrates, e.g., delicate substrates such as skin, are described. The methods include providing an adhesive tape comprising an adhesive layer and a support layer in contact with the adhesive layer. A first adhesion level between the adhesive layer and the support layer is, or can be controlled to be, less than a second adhesion level between the adhesive layer and the substrate. The methods further include applying the adhesive tape to the substrate by contacting the adhesive layer to the substrate while the support layer remains in contact with the adhesive layer; and removing the support layer from the substrate by separating the support layer from the adhesive layer.

A medical dressing includes: a lower support film; a release film; and an adhesive sheet part (110) for application, which is placed on the release film (200) and is attached to the skin, wherein the release film (200) consists of a release film part (210) for fixing and a separable release film part (220) to be separated therefrom by a cutting line (211) formed on the release film part (210) for fixing, so that a predetermined region of the separable release film part is positioned to overlap with the bottom surface of the adhesive sheet part (110), thereby allowing, during separation of the separable release film part (220) from the release film part (210) for fixing, separation together with the adhesive sheet part (110) for application, and the area of the separable release film part (220), which overlaps with the bottom surface of the adhesive sheet part (110), is relatively smaller than the area of the separable release film part, which does not overlap with the adhesive sheet part (110).

Methods and compositions for securing to and removing adhesive tapes from substrates, e.g., delicate substrates such as skin, are described. The methods include providing an adhesive tape comprising an adhesive layer and a support layer in contact with the adhesive layer. A first adhesion level between the adhesive layer and the support layer is, or can be controlled to be, less than a second adhesion level between the adhesive layer and the substrate. The methods further include applying the adhesive tape to the substrate by contacting the adhesive layer to the substrate while the support layer remains in contact with the adhesive layer; and removing the support layer from the substrate by separating the support layer from the adhesive layer.