There is provided an exhaust gas processing apparatus configured to cause a processing gas to be exposed to or come into contact with a liquid and thereby detoxify the processing gas. The exhaust gas processing apparatus comprises a suction casing provided with an inlet which the processing gas is sucked into and with an outlet which the processing gas is flowed out from; a liquid tank configured to receive an outlet-side part of the suction casing and store the liquid therein; and one or multiple spray nozzles placed in the liquid tank. The outlet of the suction casing is arranged to be located above a liquid surface of the liquid stored in the liquid tank. The one or multiple spray nozzles are configured to spray the liquid from around the outlet of the suction casing to a peripheral part of the outlet.

An apparatus and method for wet cleaning a gas stream has a housing with a gas inlet and a gas outlet, wherein, in the housing, there is at least a first washing segment that serves to clean the gas stream with a washing liquid and that is arranged in the flow path of the gas stream. Inside the housing of the apparatus, there is at least one fan that regulates air pressure along the flow path of the gas stream. A bypass channel for bypassing the flow path through the at least one washing segment as well as a regulator that is arranged in the bypass and that serves to discharge the gas stream being conveyed via the bypass channel are arranged inside the housing.

An apparatus and method for wet cleaning a gas stream has a housing with a gas inlet and a gas outlet, wherein, in the housing, there is at least a first washing segment that serves to clean the gas stream with a washing liquid and that is arranged in the flow path of the gas stream. Inside the housing of the apparatus, there is at least one fan that regulates air pressure along the flow path of the gas stream. A bypass channel for bypassing the flow path through the at least one washing segment as well as a regulator that is arranged in the bypass and that serves to discharge the gas stream being conveyed via the bypass channel are arranged inside the housing.

In a method of treating a gas stream (32) containing combustible and/or reactive particles (34) at least a part of the particles (34) contained in the gas stream (32) is separated from the gas stream (32) by means of a separation device (36). The particles (34) separated from the gas stream (32) by means of the separation device (36) are supplied to a collecting vessel (40). The supply of particles (34) to the collecting vessel (40) is interrupted. A flame retardant material (57) is supplied to the collecting vessel (40) so as to form a cover layer of flame retardant material (57) on the particles (34) contained in the collecting vessel (40).

In a method of treating a gas stream (32) containing combustible and/or reactive particles (34) at least a part of the particles (34) contained in the gas stream (32) is separated from the gas stream (32) by means of a separation device (36). The particles (34) separated from the gas stream (32) by means of the separation device (36) are supplied to a collecting vessel (40). The supply of particles (34) to the collecting vessel (40) is interrupted. A flame retardant material (57) is supplied to the collecting vessel (40) so as to form a cover layer of flame retardant material (57) on the particles (34) contained in the collecting vessel (40).

An apparatus for treating gaseous pollutants includes a gas inlet part, a first treatment unit, a second treatment unit and a non-mechanical flow-guiding device. The gas inlet part includes a gas inlet chamber and at least one guide pipe. The guide pipe communicates with the gas inlet chamber and guides an effluent stream from a semiconductor process to the gas inlet chamber. The first treatment unit is coupled to a bottom end of the gas inlet part and is configured to abate the effluent stream. The non-mechanical flow-guiding device is coupled to the first treatment unit. The flow-guiding device is configured to guide the effluent stream to move toward an opening. The second treatment unit is coupled to the flow-guiding device via the opening, receives the effluent stream from the first treatment unit and further abates the effluent stream.

Apparatus and methods are disclosed. The apparatus comprises: an abatement chamber of an abatement apparatus which treats an effluent stream from a semiconductor processing tool to provide a combusted effluent stream having effluent particles; and a first atomiser located downstream of the abatement chamber, the first atomiser being configured to produce droplets having a droplet size based on a particle size of the effluent particles to be removed from the combusted effluent stream. In this way, the atomizer may produce droplets which combine with or adhere to the effluent particles which assists in the removal of the effluent particles from the combusted effluent stream.

An active wet scrubbing filtration system for decontamination of a gas stream comprises components including one or more of: a) a vortexing apparatus which induces a contaminant-bearing gas into a helical flow; b) an initial scrubbing fluid spray section configured so as to project a spray of scrubbing fluid into the contaminant-bearing gas stream; c) an absorption structure; d) a condenser; and e) first and second scrubbing fluid decontamination systems that may be engaged or disengaged independently of each other. In some embodiments, the worksite comprises a clean room or one or more a semiconductor processing tools, which may include photolithography tools or photolithography tool clusters. In some embodiments, the active wet scrubbing filtration system may be useful in cleaning and recycling air or other process gasses for use in clean rooms or semiconductor processing tools.

Provided is a scrubber system in which by improving a structure of an existing scrubber inlet preventer, a diameter of the lower end of a second cleaning liquid buffer forming the lower end of the inlet preventer is extended, a separate nozzle is installed in a lower pipe part to prevent generated powder from blocking the lower end of the inlet preventer, a path of a material to be treated first descends along the inlet preventer and then first ascends along a first chamber and a second chamber, second descends to a third chamber again, wherein the an automatic pressure control system including a venturi is installed on the upper end of the third chamber to prevent a backflow of the material to be treated, and then is guided to a fourth chamber with a polypropylene absorber to second descend in the fourth chamber and discharged to an outlet.

Disclosed is a urea finishing method including an off-gas treatment, the method comprising urea finishing and supplying the off-gas to a quenching zone and to a scrub column comprising a sump and a venturi stage, wherein the sump has a split sump configuration with two compartments.