Patent classifications
B01D53/42
Nozzle block, wet scrubber device comprising nozzle block, and fume hood having wet scrubber device
In a nozzle block, a fluid is uniformly sprayed over an entire housing inside through a spray nozzle with the rotation of a nozzle coupling part, thereby increasing a contact ratio of the fluid with contaminated gas and dramatically improving the purification efficiency. Additionally, a fluid for cleaning contaminated gas is allowed to flow opposite to a flow of contaminated gas, so that the contaminated gas and the fluid cancel out, and the contact ratio increases.
Composite material, its manufacture and use in gas purification
The invention provides a composite material formed from an inorganic mesoporous, or mesoporous-like, material that is dispersed throughout a polymeric matrix formed by a crosslinked polymer that has acidic- or basic-residues and which may also optionally have further acidic- or basic-residues grafted onto the inorganic mesoporous material. The resulting composite material may be used to remove acidic or basic impurities from a gas in need thereof and can be easily regenerated.
Transfer chamber
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
Transfer chamber
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
TRANSFER CHAMBER
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.
The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
TRANSFER CHAMBER
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.
The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
Transfer chamber
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
Transfer chamber
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter. The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).
NOZZLE BLOCK, WET SCRUBBER DEVICE COMPRISING NOZZLE BLOCK, AND FUME HOOD HAVING WET SCRUBBER DEVICE
In a nozzle block, a fluid is uniformly sprayed over an entire housing inside through a spray nozzle with the rotation of a nozzle coupling part, thereby increasing a contact ratio of the fluid with contaminated gas and dramatically improving the purification efficiency. Additionally, a fluid for cleaning contaminated gas is allowed to flow opposite to a flow of contaminated gas, so that the contaminated gas and the fluid cancel out, and the contact ratio increases.
TRANSFER CHAMBER
To provide a transfer chamber capable of replacing a chemical filter without affecting an internal atmosphere, and shortening or eliminating stop time of a transfer process of a wafer (W) associated with replacement of the chemical filter.
The transfer chamber transfers the wafer (W) to or from a processing device (6) by using a transfer robot (2) provided thereinside, and includes a circulation path (CL1) formed inside of a transfer chamber (1) to circulate gas, a chemical filter unit (7) provided in the midstream of the circulation path (CL1), and a connecting and disconnecting means (8) which switches connection and disconnection of the chemical filter unit (7) to and from the circulation path (CL1).