An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

A dispensing system for dispensing hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution and pump the solution at a volumetric flow rate. The dispensing system also includes a valve to control an amount of the gas provided to the pump from the second input, a flow meter to measure the volumetric flow rate of the solution pumped by the pump, and a dispenser to receive the solution from the pump and dispense the solution to create the hot melt adhesive foam.

A dispensing system for dispensing a hot melt adhesive foam onto a substrate is described. The dispensing system comprises a pump having a first input to receive a hot melt adhesive and a second input to receive a gas, where the pump mixes the hot melt adhesive and the gas to produce a solution. The dispensing system also includes a temperature sensor to detect a temperature of the solution, a dispenser to receive the solution from the pump and dispense the solution, and a controller. The controller instructs the pump to operate at a first speed, receives the temperature of the solution, and instructs the pump to operate at a second speed that is different than the first speed in response to the signal.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An applicator for dispensing adhesive onto a substrate is described. The applicator includes a manifold and at least one dispensing module coupled to the manifold. The applicator may include a least one pump assembly removably mounted to the manifold. Each pump assembly can have an outlet in flow communication with the manifold, and an inlet in flow communication with the adhesive. The use of a removable, independently controllable pump assembly can provide an operator of the applicator greater flexibility during adhesive dispensing.