Patent classifications
B
B01
B01L
2400/00
B01L2400/02
B01L2400/028
B01L2400/028
3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING
20230338948
·
2023-10-26
·
A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.
MICRODROPLET CONTAINER AND METHOD FOR MANUFACTURING THE SAME, METHOD FOR SPREADING MICRODROPLETS, MICRODROPLET-GENERATING KIT, TEMPERATURE-CONTROLLING DEVICE, OIL PHASE COMPOSITION FOR MICRODROPLET GENERATING AND METHOD FOR TREATING THE SAME
The present application provides a microdroplet container and a method for manufacturing the same, a method for spreading microdroplets, a microdroplet-generating kit, a temperature-controlling device, an oil phase composition for microdroplet generating and a method for treating the same.