A device for closing a delivery head of a dispensing machine for delivering fluid products includes a stationary support, a drive shaft, which rotates with respect to the stationary support around a vertical axis, and can be moved with respect to the stationary support along the same vertical axis, a cup-shaped closing element carried at the distal end of an arm fixed to a lower end of the drive shaft, and a screw and nut mechanism which controls a translation of the closing element in the direction of the longitudinal axis and a rotation movement to the longitudinal axis using a single actuator.

A device for closing a delivery head of a dispensing machine for delivering fluid products includes a stationary support, a drive shaft, which rotates with respect to the stationary support around a vertical axis, and can be moved with respect to the stationary support along the same vertical axis, a cup-shaped closing element carried at the distal end of an arm fixed to a lower end of the drive shaft, and a screw and nut mechanism which controls a translation of the closing element in the direction of the longitudinal axis and a rotation movement to the longitudinal axis using a single actuator.

A pump arrangement, in particular in a coating installation for the coating of components, such as a painting installation for the painting of motor vehicle body components, is provided. The pump arrangement includes a plurality of adjustable pumps for delivering a coating agent, e.g. for delivering a sealing agent for the sealing of weld seams on a motor vehicle body component. The pumps are connected in parallel such that the pumps extract the coating agent for delivery from a common inlet line and deliver said coating agent into a common outlet line. The arrangement further includes a control device for the open-loop or closed-loop control of one fluid variable at the outlet of the individual pumps, respectively, wherein the control device actuates the individual pumps individually, and/or a monitoring unit, which switches the pumps on and off non-simultaneously.

The disclosure relates to a cleaning device for cleaning a nozzle applicator, which is designed for applying a coating agent to a component and has a plurality of application nozzles in a nozzle region in order to discharge the coating agent through the application nozzles during application in an application direction. The cleaning device comprises a rinsing agent supply for supplying a rinsing agent for cleaning the nozzle applicator, and a docking interface for docking the nozzle applicator to be cleaned to the cleaning device. The disclosure provides that the docking interface is configured to flush the rinsing agent into the nozzle applicator through the application nozzles of the nozzle applicator in a direction opposite to the normal application direction. Furthermore, the disclosure comprises a corresponding cleaning method.

The disclosure relates to a cleaning device for cleaning a nozzle applicator, which is designed for applying a coating agent to a component and has a plurality of application nozzles in a nozzle region in order to discharge the coating agent through the application nozzles during application in an application direction. The cleaning device comprises a rinsing agent supply for supplying a rinsing agent for cleaning the nozzle applicator, and a docking interface for docking the nozzle applicator to be cleaned to the cleaning device. The disclosure provides that the docking interface is configured to flush the rinsing agent into the nozzle applicator through the application nozzles of the nozzle applicator in a direction opposite to the normal application direction. Furthermore, the disclosure comprises a corresponding cleaning method.

A solution dispense system for a semiconductor manufacturing process includes a longer circulation loop in order to minimize the idle section from resist pump to dispense nozzle. A t-valve and control valve are disposed close to the nozzle in order to decrease the idle section and reduce material consumption.

A solution dispense system for a semiconductor manufacturing process includes a longer circulation loop in order to minimize the idle section from resist pump to dispense nozzle. A t-valve and control valve are disposed close to the nozzle in order to decrease the idle section and reduce material consumption.

An inkjet-type vehicle painting machine capable of keeping temperature elevation of a nozzle head to a certain temperature or less. The painting robot comprises a power supply means for supplying power to drive a piezoelectric substrate of a nozzle head, and a robot arm for moving the nozzle head. The nozzle head is provided in an explosion-proof housing equipped with an explosion-proof construction. A heat dissipation means that dissipates heat generated from the nozzle head within the explosion-proof housing is attached to the nozzle head. A temperature measurement means for measuring the temperature of the heat dissipation means is attached to the heat dissipation means.

A moisture control apparatus for a cooking chamber of a cooking device. A cooking system that can include the cooking device and the moisture control apparatus connected to the cooking chamber of the cooking device. The moisture control apparatus can include a control portion and a dispersal portion. The control portion can be located on the outside of the cooking device. The control portion can control the flow of water to the dispersal portion so as to control moisture on a food in the cooking chamber of the cooking device by providing, by the dispersal portion, a mist or fog of water particles to the cooking surface of the cooking chamber. The dispersal portion can be located inside the cooking chamber of the cooking device, and the control portion can be located outside the cooking chamber of the cooking device.

A multi-axis mechanism device includes: a base module, a first moving module, a second moving module, a third moving module, a reaction module, a tilting module and a rotating module. The first moving module performs a first axial movement relative to the movable bearing platform to drive the reaction module to be displaced relative to the movable bearing platform. The second moving module performs a second axial movement relative to the first moving module to drive the reaction module to be displaced relative to the first moving module. The third moving module drives the movable bearing platform to perform a third axial movement relative to the module body to drive the reaction module to be displaced relative to the module body. The reaction module is driven by the tilting module to perform titling action and by the rotating module to perform rotating operation relative to the central axis.