A glue applying mechanism of an edge banding machine for applying glue to an oblique surface and a vertical surface of a workpiece includes a base including a glue tub, and a glue applying unit rotatably disposed on the glue tub and including a glue shaft and an obliquely glue applying member connected to the top end of the glue shaft and having a glue applying surface which is a tapered surface with a wide top and a narrow bottom. At least the partial top of the glue shaft and the glue applying surface are exposed outside the glue tub. The glue applying unit is rotatable to extract the glue in the glue tub to the outer surface of the glue shaft and the glue applying surface, enabling the glue to be applied to the oblique and vertical surfaces of the workpiece simultaneously by only one glue applying mechanism.

A high viscosity material is discharged in the form of a continuous thread from an application nozzle toward an end of a workpiece and a space S on the side of the workpiece so that the high viscosity material in the form of the thread adheres to a front surface of the workpiece and the high viscosity material discharged in the form of the thread into the space on the side of the workpiece pivots around an edge of the workpiece to a back surface of the workpiece and adheres to the back surface of the workpiece. The high viscosity material can thus be applied to both the front and back surfaces of the workpiece in one step of discharging the high viscosity material only from the front surface side of the workpiece.

A glue applying mechanism of an edge banding machine includes a base, a glue applying unit and a glue quantity regulator. The base includes a glue tub. The glue applying unit is rotatably disposed on the glue tub of the base and includes a glue shaft and an obliquely glue applying member connected with the glue shaft. The glue quantity regulator is rotatably disposed on the base and includes a rotatable shaft, and a regulating plate and a blocking plate, which are connected with the rotatable shaft. The regulating plate is rotatable along with the rotatable shaft to cause edges of the regulating plate adjacent to the glue applying unit at the same time. The blocking plate is fixed to the rotatable shaft separately from the regulating plate. The above-described configuration of the glue applying mechanism is effective in controlling the applied glue quantity in thickness.

A glue applying mechanism of an edge banding machine includes a base, a glue applying unit and a glue quantity regulator. The base includes a glue tub. The glue applying unit is rotatably disposed on the glue tub of the base and includes a glue shaft and an obliquely glue applying member connected with the glue shaft. The glue quantity regulator is rotatably disposed on the base and includes a rotatable shaft, and a regulating plate and a blocking plate, which are connected with the rotatable shaft. The regulating plate is rotatable along with the rotatable shaft to cause edges of the regulating plate adjacent to the glue applying unit at the same time. The blocking plate is fixed to the rotatable shaft separately from the regulating plate. The above-described configuration of the glue applying mechanism is effective in controlling the applied glue quantity in thickness.

A glue application roller for use in a gluing assembly equipped with at least one scooping roller includes a glue roller body that is provided with a central hole to receive a drive shaft. The glue roller body has at least two parts including a base and an outer ring. The base is operatively connected to the drive shaft by a non-positive fit. The outer ring is configured with at least one cavity. The base and the outer ring are coupled to each other non-positively via at least one first means. On at least one side of the glue roller body, there are second means that ensure that compressed air and/or another gaseous or liquid medium is fed into or discharged from the cavity so as to effectuate a change in a circumferential contour of the cavity.

An adhesive transfer system for applying a pattern of adhesive to a web of tipping paper as it is being fed through a smoking article filter assembly unit is disclosed. It comprises a transfer roller and an applicator roller. The transfer roller has an engraved pattern on its surface that corresponds to the pattern of adhesive to be applied to the tipping paper web. The applicator roller is nipped with the transfer roller so that adhesive received on its surface is transferred from said engraved region onto the applicator roller as the transfer roller and applicator roller rotate to form an adhesive pattern on the applicator roller for subsequent transfer onto a moving web of tipping paper in contact with said applicator roller. The engraved pattern comprises individual adhesive containing cells to break up adhesive that coats the engraved region of the transfer roller.

A device for applying adhesive to a substrate, having an application roller that is rotatable about an axis, an installation for dispensing adhesive to a circumferential area of the application roller, a dispensing region of the application roller for dispensing adhesive from the application roller, and having a doctor blade, wherein the dispensing region for adhesive in the rotation direction of the application roller is located behind the installation for dispensing the adhesive to the application roller and ahead of the doctor blade. In such a device it is provided that the application roller is rotatable about a vertical axis and the excess adhesive wiped by the doctor blade reaches a collection installation that is located below the doctor blade. In a method for applying adhesive to a substrate, excess adhesive that has not been applied to the substrate is disposed of.

The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.

In processing a peripheral edge part of a substrate by a processing liquid, upward scattered liquid droplets may be produced. Accordingly, in the invention, the processing liquid is caused to land on the peripheral edge part of the substrate from a discharge port while the discharge port is positioned to a bevel processing position lower than an eaves part of a cup in a vertical direction with the peripheral edge part of the substrate covered vertically from above by the eaves part. Thus, the eaves part collects upward scattered liquid droplets. As a result, the re-adhesion of the upward scattered liquid droplets to the substrate and the scattering thereof to a surrounding atmosphere are suppressed.

The invention includes an upper sealing member fixed near a ceiling wall of a processing chamber and a lower sealing member provided movably in a vertical direction below the upper sealing member. A sealed space is formed by moving down the lower sealing member to a lower limit position where an upper end part of the lower sealing member is aligned or partially overlapped with a lower end part of the upper sealing member in the vertical direction. On the other hand, a conveyance space for carrying the substrate to and from a substrate holder is formed by moving up the lower sealing member to a retracted position above the lower limit position.