Systems for creating electrodes for polymer electrolyte membrane fuel cells include an XY stage having a heated vacuum table physically coupled to the XY stage. The vacuum table has a working face with a plurality of channels formed therein to communicate vacuum pressure from a port coupled to a vacuum source to the channels. A sheet of perforated heat-conductive material has staggered holes configured to evenly distribute the vacuum pressure from the channels through the perforated sheet. A heat-conductive wire mesh is placed over the perforated sheet, and has openings smaller than the staggered holes such that a membrane material placed on the wire mesh is not deformed by the vacuum pressure. A nanopipette or micropipette coupled to a pump is configured to deposit electrode ink onto an exposed surface of the membrane material as the controller device causes the XY stage to move the vacuum table to control deposition of the electrode ink onto the surface of the membrane material.

A flow detector for monitoring an adhesive flow in an adhesive applicator includes a sensor device arranged in the adhesive flow. The sensor device is formed as a capacitive sensor.

A pump arrangement, in particular in a coating installation for the coating of components, such as a painting installation for the painting of motor vehicle body components, is provided. The pump arrangement includes a plurality of adjustable pumps for delivering a coating agent, e.g. for delivering a sealing agent for the sealing of weld seams on a motor vehicle body component. The pumps are connected in parallel such that the pumps extract the coating agent for delivery from a common inlet line and deliver said coating agent into a common outlet line. The arrangement further includes a control device for the open-loop or closed-loop control of one fluid variable at the outlet of the individual pumps, respectively, wherein the control device actuates the individual pumps individually, and/or a monitoring unit, which switches the pumps on and off non-simultaneously.

Systems and methods for air pressure control in a hot melt liquid dispensing system are described. An example hot melt liquid dispensing system includes a pump that pumps hot melt liquid to an applicator. The hot melt liquid dispensing system also includes an air flow path that supplies pressurized air to the pump and an electronic pressure sensor associated with the air flow path. The hot melt liquid dispensing system also includes a controller that receives an electronic signal from the electronic pressure sensor indicative of an air pressure in the air flow path and causes adjustment to the air pressure in the air flow path based on the electronic signal from the electronic pressure sensor.

A method includes receiving a model of the material dispenser and, at a first characterization period of a material bead dispensing operation, communicating, to the material dispenser, a first characterization flow rate input. The method also includes, at a second characterization period of the material bead dispensing operation, communicating, to the material dispenser, a second characterization flow rate input. The method also includes generating, using at least one sensor, three-dimensional data associated with a material bead corresponding to the material bead dispensing operation. The method also includes characterizing at least one parameter of the model of the material dispenser using at least the first characterization flow rate input, the second characterization flow rate input, and the three-dimensional data associated with the material bead.

An application method for applying an adhesive to an object includes applying, prior to applying the adhesive to a specified part of the object, the adhesive to a part different from the specified part, calculating an application quantity of the adhesive applied to the part different from the specified part, making a first correction configured to correct an application condition of the adhesive based on basis of a result of the calculation, and applying the adhesive to the specified part using the application condition corrected in the first correction.

A substrate processing method is executed by a substrate processing apparatus. The substrate processing apparatus includes a processing tank, and a bubble supply pipe disposed in the processing tank. In the substrate processing method, a substrate holding section immerses a substrate in an alkaline processing liquid stored in the processing tank. A bubble supply section supplies bubbles to the alkaline processing liquid from below the substrate with the substrate immersed in the alkaline processing liquid, the bubbles being supplied from a plurality of bubble holes provided in the bubble supply pipe.

A coating apparatus includes a discharge unit, moving unit, and a controller. The discharge unit includes a nozzle array in which a plurality of nozzles is arranged, and discharges a coating material from each of the plurality of nozzles. The moving unit moves a position of the discharge unit with respect to a to-be-coated surface along a plurality of paths substantially orthogonal to the nozzle array. The controller determines, based on coating information, a width of a recoated portion on which the coating material is discharged in an overlapping manner between two adjacent paths among the plurality of paths, and determines a discharge amount from each of the plurality of nozzles so that a discharge amount from each of nozzles at an end portion of the nozzle array corresponding to the recoated portion is less than a discharge amount from each of other nozzles of the nozzle array.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space for treating a substrate therein; a support unit configured to support the substrate at the treating space; a nozzle for supplying a liquid to the substrate placed on the support unit; a liquid supply unit configured to supply the liquid to the nozzle and have a flow meter; and a flow rate measuring unit configured to verify an error of the flow meter; and a controller for controlling the liquid supply unit and the flow rate measuring unit, and wherein the flow rate measuring unit comprises: a cup for accommodating the liquid; a measuring means configured to verify a level of the liquid accommodated in the cup; and a discharge line for discharging the liquid within the cup and having a discharge valve installed thereon, and wherein the controller controls the liquid supply unit to discharge a liquid of a first amount to the cup for a first time in a state at which the discharge valve is closed, and controls the measuring means to determine whether an error has occurred in the flow meter by determining whether the level of the liquid accommodated in the cup is the first amount.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a head unit configured to discharge an ink to a substrate; a supply unit configured to supply the ink to the head unit and including a reservoir having an inner space; and a pressure adjusting unit configured to adjust a pressure of the inner space, and wherein the pressure adjusting unit comprises: a first pressure adjusting unit; and a second pressure adjusting unit in which a size for changing a pressure of the inner space per unit time is greater than the first pressure adjusting unit.