A handheld device, in particular a cartridge press and/or tubular bag press, for dispensing filling material into a joint, including: a handle assembly for manually gripping the handheld device and for moving the handheld device along a joint path, a dispensing device for dispensing the filling material into the joint, and a sensor device which is designed to detect an influencing quantity. The influencing quantity influences the body geometry of a filling material body formed by the filling material dispensed into the joint, in which the handheld device is adapted to adjust a dispensing rate (r) at which the dispensing device dispenses the filling material based on the detected influence quantity.

Embodiments of the present disclosure generally relate to apparatus and methods for manufacturing continuous sucker rods with protective coatings. One embodiment provides a coating system including a first drive station disposed on a first end of a coating line, a second drive station disposed on a second end of the coating line to move a continuous sucker rod along the coating line from the first drive station to the second drive station, a heater disposed along the coating line, and a first coating station disposed along the coating line.

When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.

A method for manufacturing an electrode is provided, the method including coating and drying of an electrode paste and being able to highly suppress variations in the weight per unit area of the active material layer. The method for manufacturing an electrode disclosed herein includes the steps of: coating an electrode paste onto a current collecting foil from a die; and drying the coated electrode paste. Here, the current collecting foil is conveyed by a backup roll. A variation in at least one of thickness and width of the coated electrode paste is measured. The peripheral speed of the backup roll is changed according to a measurement result of the variation so that the variation becomes small.

A robot synchronization sealer discharge system is provided. The robot synchronization sealer discharge system is interlocked with a robot for a sealer work of a vehicle factory and includes: a sealer gun mounted on a robot and moving along an application path of a vehicle body to discharge a sealer and a communication unit for receiving a TCP speed of the sealer gun moving based on robot operation. A synchronization controller assigns a unique ID and a received TCP time to the TCP speed and generates a discharge instruction message recording the sealer discharge amount according to the TCP speed. A sealer controller adjusts a discharge of the sealer gun based on the discharge instruction message and feeds back the sealer time according to a discharge completion to the synchronization controller.

In a substrate processing apparatus, neutralization processing is performed on a substrate by a neutralization device provided in a thermal processing section. In the neutralization device, at least one of a holder that holds the substrate and an emitter that emits vacuum ultraviolet rays is moved relative to another one in one direction. At this time, one surface of the substrate is irradiated with the vacuum ultraviolet rays emitted by the emitter. When the entire one surface of the substrate is irradiated with the vacuum ultraviolet rays, the neutralization processing ends. Thereafter, the substrate on which the neutralization processing has been performed is transported to a coating processing unit in a coating processing section. In the coating processing unit, a film of a processing liquid is formed on the one surface of the substrate on which the neutralization processing has been performed.

An apparatus for coating carpet webs in a coating apparatus with varying adhesives includes a controller, one or more sensors for detecting a volume of a puddle of the adhesive pooled in front of an application roller, and an electronic valve in fluid communication with each of a plurality of mixers. The electronic valve directs flow of the adhesive from any of the mixers to the coating apparatus. To switch from one of the adhesives to new adhesive as a next carpet web passes through the coating apparatus, the controller calculates a remaining length of the carpet web that can be coated with the adhesive in the puddle of adhesive based on the volume of the puddle, so that the puddle of the adhesive coats the carpet web, and then proximate a seam to the next carpet web, the new adhesive begins to coat the next carpet web.

In a substrate processing apparatus, neutralization processing is performed on a substrate by a neutralization device provided in a thermal processing section. In the neutralization device, at least one of a holder that holds the substrate and an emitter that emits vacuum ultraviolet rays is moved relative to another one in one direction. At this time, one surface of the substrate is irradiated with the vacuum ultraviolet rays emitted by the emitter. When the entire one surface of the substrate is irradiated with the vacuum ultraviolet rays, the neutralization processing ends. Thereafter, the substrate on which the neutralization processing has been performed is transported to a coating processing unit in a coating processing section. In the coating processing unit, a film of a processing liquid is formed on the one surface of the substrate on which the neutralization processing has been performed.

Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.