The present invention provides an adhesive application device configured to apply a necessary and sufficient amount of an adhesive to a thin steel strip without causing the problem of increase in the equipment cost. The present invention also provides an apparatus for producing a laminated steel core having the adhesive application device. The present invention further provides a method for producing a laminated steel core. The adhesive application device comprises adhesive application devices (3), (4) that are integrated into a single process, wherein the adhesive application devices (3), (4) are configured to independently apply an adhesive to different locations on the same surface of a thin steel strip (2) at the same or different timings.

A modified technology of spin coating which is named Two-Axis spin coating is disclosed. The innovative Two-Axis spin coating apparatus is a rotary device that spins the substrate horizontally the same as conventional spin coaters while the whole horizontal spinning system can be rotated vertically. The vertical rotation of the substrate generates a vertical centrifugal force perpendicular to the surface of the substrate which allows the coating face with an elevated artificial gravity acceleration. The elevation of gravity acceleration adjusts and normalizes the local high and low surface tension stresses on the surface of the coated film. This elevation of gravity also increases the weight of coating elements artificially and obliges the wavy surface convex regions to flow toward the concave areas. The elevation of gravity also obliges the lighter probable air bubbles inside the layer, immediately before the coating surface skinning process, move toward the surface and drain out from the layer. The invention provides a method to level the layer's edge beads, level the coated surface, drain out probable micro sized air bubbles inside the layer and form denser film simultaneously.

A substrate processing apparatus may include a chamber having a working space, maintaining a vacuum state, and including an upper wall positioned on the working space, a nozzle assembly positioned in the working space, and including nozzles, and a lifting module including a frame positioned outside of the chamber, a lifting part that lifts the frame, and at least one shaft passing through the upper wall, connected to each of the frame and the nozzle assembly, and extending in a direction of gravity.

A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

A system for testing an integrated-circuit wafer includes a probe card and a dispenser assembly. The probe card includes a circuit board and a probe needle coupled to the circuit board. The dispenser assembly is coupled to the probe card and is configured to deliver a metered amount of dielectric fluid to the tip of the probe needle. Methods are also disclosed.

A system for depositing substances onto a deposition surface can comprise a first contact spotter comprising multiple spotting orifices fed by multiple fluid inlet conduits such that the first contact spotter is capable of depositing multiple spots of different substances onto the deposition surface simultaneously, and a second contact spotter comprising a second spotting orifice fed by a second fluid inlet conduit. The system can also include a positioning device adapted to alternatively position and seal the first contact spotter and second contact spotter on the deposition surface at an overlapping location.

A system for depositing substances onto a deposition surface can comprise a first contact spotter comprising multiple spotting orifices fed by multiple fluid inlet conduits such that the first contact spotter is capable of depositing multiple spots of different substances onto the deposition surface simultaneously, and a second contact spotter comprising a second spotting orifice fed by a second fluid inlet conduit. The system can also include a positioning device adapted to alternatively position and seal the first contact spotter and second contact spotter on the deposition surface at an overlapping location.

A fastener sealing tool that utilizes curable material to seal the area around a fastener connected to a surface. In one embodiment of the invention the fastener sealing tool is a manually operated tool, hand operated by a user who visually identifies the fastener to be sealed and then operates the fastener sealing tool to seal the desired fastener. In a second embodiment of the invention the fastener sealing tool is an end of arm tool for a robot that automatically identifies or is programmed to move to the location of the fastener, and then seal the fastener using the fastener sealing tool. The fastener sealing tool utilizes a load cell to control the flow of material and to detect certain unwanted conditions.

A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.