Nanostructured coating materials, methods of their production, and methods of use in a variety of applications are described. The nanostructured materials described herein include one or more 2.sup.+ and/or 3.sup.+ metal ion(s), optionally in a ternary phase, on a substrate.

Nanostructured coating materials, methods of their production, and methods of use in a variety of applications are described. The nanostructured materials described herein include one or more 2.sup.+ and/or 3.sup.+ metal ion(s), optionally in a ternary phase, on a substrate.

Coating compositions for coating fluid handling components, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of a fluid handling component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

Coating compositions for coating fluid handling components, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of a fluid handling component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

The present disclosure provides packaging materials and products including such as a multilayer structure comprising a base (X), a layer (Y), and a layer (Z), in which the layer (Y) and the layer (Z) are adjacently stacked in at least one pair of the layer (Y) and the layer (Z).

The present disclosure provides packaging materials and products including such as a multilayer structure comprising a base (X), a layer (Y), and a layer (Z), in which the layer (Y) and the layer (Z) are adjacently stacked in at least one pair of the layer (Y) and the layer (Z).

The present invention provides a film forming method of forming a film on a substrate, wherein the substrate includes a region including a first concave portion and a second concave portion, the first concave portion has a width larger than that of the second concave portion, and the film forming method includes: selectively supplying a first material into the first concave portion and molding the first material; and supplying a second material onto the region and molding the second material, such that the second concave portion is filled with the second material and a planarization film of the second material is formed over all of the region.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a first main surface toward a second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper.

Forming a two-dimensional polymeric sheet includes translating a portion of a flexible substrate through a first liquid precursor to coat the portion of the flexible substrate with the first liquid precursor, thereby yielding a precursor-coated portion of the flexible substrate. The precursor-coated portion of the flexible substrate is translated through an interface between the first liquid precursor and a second liquid precursor, thereby reacting the first liquid precursor on the precursor-coated portion of the flexible substrate with the second liquid precursor to yield a polymer-coated portion of the flexible substrate.