An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.

The present invention relates to a film including a base layer and an oil-containing layer formed on the base layer, wherein the oil-containing layer contains an oil ingredient which bleeds out from a surface of the oil-containing layer at a given temperature or lower, the base layer is an elemental metal or a multilayer structure including a metal layer, and the elemental metal or the metal layer is in contact with the oil-containing layer.

Plasmonic graphene is fabricated using thermally assisted self-assembly of plasmonic nanostructure on graphene. Silver nanostructures were deposited on graphene as an example.

A coating composition for applying a very thin film coating to a substrate such as a polymeric film comprises a copolymer such as a block copolymer (BCP) that is compatible with the substrate, an alcohol solvent or solvents capable of dissolving the copolymer, a hydrolysed metal alkoxide precursor, a carboxylic acid stabiliser, and an active agent in an ionic, molecular, or small nanoparticle form. The active agent is configured to provide a functionality to the coating composition, selected from antimicrobial, antifungal, barrier, therapeutic, electrical, electronic, magnetic and optical. The composition is a sol comprising a continuous non-sedimentable/stable suspension of very small sized (of nano order) amorphous inorganic polymers in their oligomeric or polymeric state, and comprising the active agent dispersed in a hydrolysed metal alkoxide-BCP matrix. Substrates coated with very thin coatings are also provided, including coated LDPE which is activated before coating by UV/ozone, plasma or corona treatment prior to deposition of a wetting layer.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

A method for producing a metal oxide-polymer laminate, including preparing a polymer layer, and forming a metal oxide layer on a surface of the polymer layer by an aerosol deposition method so that at least a portion of the metal oxide layer is embedded in the polymer layer in a thickness direction thereof.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.