According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.

The disclosure provides an apparatus for depositing poly(p-xylylene) onto a component. The apparatus comprises a deposition chamber configured to receive a component to be coated therein; an electrical power supply; a platen, disposed inside the deposition chamber and comprising an electrically conductive material, wherein the platen is electrically connected to the electrical power supply and configured to support the component; a monomer reservoir, configured to receive a monomer of poly(p-xylylene) therein; a monomer conduit extending between the monomer reservoir and the deposition chamber; and a heating means configured to heat the monomer reservoir and the monomer conduit to a temperature of between 25 and 250° C.

Systems and devices for continuous, high-throughput production of electrically conductive yans, fibers or fabrics. In one embodiment, the system comprises a first process chamber for coating the yarn, fiber or fabric with an electrically conductive material and a second process chamber for encapsulating the electrically conductive yarn, fiber or fabric with an encapsulating material. In another embodiment, device for printing an encapsulated electrically conductive material on a yarn, fiber or fabric, includes print head(s) for coating and encapsulating a yarn, fiber or fabric.

A substrate processing apparatus including: a processing container; a stage installed in the processing container and configured to place a substrate thereon; a ceiling plate installed at a position facing the stage in the processing container; a driver configured to raise and lower the stage; an exhaust port formed in a side wall of the processing container and configured to exhaust a gas in the processing container; and a controller configured to control conductance of a space between the exhaust port and a processing space between the stage and the ceiling plate by controlling the driver to adjust a distance between a peripheral edge portion of the stage and a facing member disposed at a position facing the peripheral edge portion in the processing container.

Methods for forming a coating can include preparing a nanocomposite film including surface modified silicon dioxide nanoparticles, applying an oxygen plasma treatment to the nanocomposite film to form a treated nanocomposite film, and applying a fluorosilane solution to the treated nanocomposite film to form the coating. A coating can include a nanocomposite film including surface modified silicon dioxide nanoparticles, the nanocomposite film having an oxygen plasma treated surface, and a monolayer of a fluoro alkyl chain

Methods for forming a coating can include preparing a nanocomposite film including surface modified silicon dioxide nanoparticles, applying an oxygen plasma treatment to the nanocomposite film to form a treated nanocomposite film, and applying a fluorosilane solution to the treated nanocomposite film to form the coating. A coating can include a nanocomposite film including surface modified silicon dioxide nanoparticles, the nanocomposite film having an oxygen plasma treated surface, and a monolayer of a fluoro alkyl chain

The present disclosure provides a hydrophobic low-dielectric-constant film and a preparation method therefor. The low-dielectric-constant film is formed from one or more fluorine-containing compounds A by means of a plasma enhanced chemical vapor deposition method, and the one or more fluorine-containing compounds comprise a compound having the general formula C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2y−n+2 or C.sub.xSi.sub.yO.sub.mH.sub.nF.sub.2x+2y−n, x being an integer from 1 to 20, y being an integer from 0 to 8, m being an integer from 0 to 6, and n being 0, 3, 6, 7, 9, 10, 12, 13, 15, 16, 17 and 19. Thus, a nano-film having a low dielectric constant and good hydrophobicity is formed on the surface of a substrate.

A substrate with a water and oil repellent layer having excellent abrasion resistance and a method for producing the substrate are provided. The substrate with a water and oil repellent layer contains a substrate, an undercoat layer formed on the surface of the substrate, and a water and oil repellent layer formed on the surface of the undercoat layer. The undercoat layer contains an oxide containing silicon and a specific element. The water and oil repellent layer is made of a hydrolytic condensation compound of a fluorinated ether compound, which is a compound represented by the formula (A1) or a compound represented by the formula (A2):

R.sup.f—O—(R.sup.f1O).sub.m—R.sup.f2[—R.sup.1—C(—R.sup.2-T).sub.a(—R.sup.3).sub.3-a].sub.b  (A1)

[(T-R.sup.2—).sub.a(R.sup.3—).sub.3-aC—R.sup.1—].sub.bR.sup.f2—O—(R.sup.f1O).sub.m—R.sup.f2[—R.sup.1—C(—R.sup.2-T).sub.a(—R.sup.3).sub.3-a].sub.b  (A2).

A protective coating is provided, including a first coating formed on a surface of a substrate by plasma polymerization deposition when the substrate contacts plasmas. The plasmas include a plasma of a monomer A and a plasma of a monomer B, wherein the monomer A includes both a silicon structural unit of formula (I) and at least one amine group structural unit of formula (II) or formula (III); and monomer B includes a terminal carboxyl group structural unit. Further disclosed is a preparation method of the protective coating, the method includes: providing a substrate, gasifying monomers including the monomer A and the monomer B and then introducing the monomers into a plasma reactor, performing a plasma discharge, and forming the first coating on the surface of the substrate by plasma polymerization. Further disclosed is a device, which is provided with the protective coating on at least part of the surface thereof.

A coated substrate includes: a substrate and a first layer on at least a portion of the substrate, the first layer including a polymer selected from the group consisting of an acrylic, an epoxy, a polyurethane, a copolymer thereof, and a mixture thereof, and an additive selected from the group consisting of an ultraviolet light (UV) absorber, a UV stabilizer, and a mixture thereof. The coated substrate further includes a second layer on at least a portion of the first layer, and a third layer on at least a portion of the second layer. A method of forming a coated substrate includes: forming a first layer on at least a portion of a substrate; forming a second layer on at least portion of the first layer; and forming a third layer by plasma enhanced chemical vapor deposition on at least a portion of the second layer.