Disclosed are an anti-icing material with stealth function, a preparation method and use thereof. The anti-icing material with stealth function according to the disclosure includes an electrically insulating and thermally insulating layer, a patterned heating layer, an electrically insulating and thermally conducting layer, and a hydrophobic layer, that are disposed sequentially through stacking, wherein the patterned heating layer has a patterned hollowed-out structure.

Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

A method of packaging a battery device with a metal shell, comprising: applying a waterborne two-component polyurethane composition to the metal shell of the battery device, and drying the applied polyurethane composition to form a packaging layer; wherein the polyurethane composition comprises, (A) an aqueous dispersion comprising a hydroxyl-functional polymer, wherein the hydroxyl-functional polymer comprises, by weight based on the weight of the hydroxyl-functional polymer, from 20% to 50% of structural units of a hydroxy-functional alkyl (meth)acrylate; from 0.1% to 10% of structural units of an acid monomer, a salt thereof, or mixtures thereof; and structural units of a monoethylenically unsaturated nonionic monomer; and (B) a polyisocyanate.

A component used in an air conditioner includes a substrate and a nano-coating formed on a surface of the substrate, wherein the nano-coating includes a lower coating formed on the surface of the substrate; and an upper coating formed on the upper surface of the lower coating, a coating composition of the upper coating includes nanoparticles having a diameter of 10 nm to 30 nm, and an interval between adjacent nanoparticles among the plurality of nanoparticles located on a surface of the upper coating is 10 nm to 30 nm.

A component used in an air conditioner includes a substrate and a nano-coating formed on a surface of the substrate, wherein the nano-coating includes a lower coating formed on the surface of the substrate; and an upper coating formed on the upper surface of the lower coating, a coating composition of the upper coating includes nanoparticles having a diameter of 10 nm to 30 nm, and an interval between adjacent nanoparticles among the plurality of nanoparticles located on a surface of the upper coating is 10 nm to 30 nm.

A pre-press process includes a first step for bonding a first end portion of each of a plurality of electronic component bodies to a bonding surface of a flat plate material disposed in a jig, a second step for moving the jig relative to a surface plate, a third step for bringing a second end portions of each of the plurality of electronic component bodies into contact with the surface plate while the flat plate material is in a softened state so that the flat plate material is deformed to align respective positions of end surfaces of the second end portions, a fourth step for curing the flat plate material, and then a fifth step for moving the jig relative to the surface plate to separate from the surface plate the plurality of electronic component bodies in which the respective positions of the end surfaces are aligned.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a first main surface toward a second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper.