A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate (20010) being cleaned.

The present disclosure provides an ultrasonic drive and driving method configured for driving an ultrasonic tool. The ultrasonic drive includes a switch module, a sensing element and a control element. The sensing element senses the voltage and current of the ultrasonic tool and generates a sensing signal accordingly. The control element receives the sensing signal and outputs a control signal. The switch module outputs an ultrasonic signal according to the control signal for controlling the vibration of the ultrasonic tool. When the ultrasonic drive operates a frequency sweep function, the control element determines an operating interval and an operating frequency of the ultrasonic signal. When the ultrasonic drive operates a frequency following function, the control element adjusts the operating frequency according to the sensing signal for keeping the impedance of the ultrasonic tool consistent.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

The invention relates to the field of transducers, in particular linear vibration generators. It concerns a vibration generator, devices comprising such a vibration generator and a related treatment method.

A vibration generator comprising a mass, a coil, a permanent magnet and a housing, wherein the mass can be set in an oscillatory motion with respect to the housing by applying a current to the coil, and the vibration generator further comprising an axle, wherein the oscillatory motion is along the axle, and in that the mass comprises the permanent magnet and the coil is fixed to the housing.

A variable-frequency surface acoustic wave electronic cigarette includes an atomizer. An atomization cavity is disposed in the atomizer, and a variable-frequency surface acoustic wave atomization chip is disposed at a lower portion of the atomization cavity. An inverted trapezoidal interdigital transducer is disposed on the variable-frequency surface acoustic wave atomization chip. An e-liquid storage cavity is disposed in the atomization cavity. A porous ceramic sheet is disposed between the e-liquid storage cavity and the atomization chip. The new variable-frequency surface acoustic wave electronic cigarette can realize any adjustment of the working frequency within a set range, thereby realizing the autonomous regulation and control of a smoke particle size after atomization of the e-liquid.

A piezoelectric driving device includes a piezoelectric vibrating body and a driving circuit. The piezoelectric vibrating body includes a contact which comes into contact with a driven member, and a piezoelectric element which generates vibration in accordance with a driving voltage. The driving circuit sets a driving frequency of the driving voltage to a first frequency and starts the driving at the time of initiation from a stopped state, and sets the driving frequency of the driving voltage to a second frequency lower than the first frequency in a driving state after the initiation.

An apparatus, system and method for providing a surgical handpiece. The apparatus, system and method may include: an ultrasonic horn having an emulsifying needle at a distal end thereof; a plurality of piezoelements about a proximal end of the ultrasonic horn; a plurality of flexible electrode segments comprising first sets of the electrode segments atop each of the piezoelements and second sets of the electrode segments below each of the piezoelements, and comprising at least pairs of the electrode segments in which each pair comprises an electrode segment atop a one of the piezoelements and a paired electrode segment below that one of the piezoelements; a plurality of flexible interconnections that electrically interconnect at least the first sets and second sets, and the pairs, flexibly about each of the plurality of piezoelements; and a power source applied via a controlled double-pole, double-throw (DPDT) switch.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A system includes a needle, an actuator assembly and a generator. The needle is configured to be vibrated so as to emulsify a lens of an eye. The actuator assembly, includes a first actuator, a second actuator and a third actuator, which are distributed around a longitudinal axis of the needle and are configured to vibrate along the longitudinal axis in response to a first driving signal, a second driving signal and a third driving signal, respectively. The generator is configured to generate the first driving signal, the second driving signal and the third driving signal, so as to vibrate the needle in accordance with a predefined pattern.

An ultrasound vibrating-type defect detection apparatus (100) for detecting a defect in a semiconductor apparatus (10) is provided with: an ultrasound vibrator (42); a high-frequency power supply (40); a camera (45); and a controller (50) for adjusting the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and for performing detection of a defect in the semiconductor apparatus (10). The controller (50) causes the camera (45) to capture an image of the semiconductor apparatus (10) while varying the frequency of high-frequency power supplied from the high-frequency power supply (40) to the ultrasound vibrator (42), and performs detection of a defect in the semiconductor apparatus (10) on the basis of the captured image.