B06B1/06

Device and Method for Reducing Foreign Body Response from Neural Implants

A device for reducing foreign body response in a subject caused by an electrode implanted in a subject's tissue. A base is secured to the subject, having a base aperture in proximity to the target site. The base can receive and align a body thereon. A body contains a chamber extending between a chamber aperture, aligned with the base aperture, at one end and a chamber opening at an opposite end. The chamber contains an acoustic coupling medium, such as polyvinyl alcohol cryogel, transmits acoustic vibrations from a transducer without altering their frequency. The transducer is mounted to the device and is configured to transmit acoustic vibrations into the chamber and through said acoustic coupling medium to the subject tissue at the target site, creating an acoustic field in the target site sufficient to reduce foreign body response in the subject where the electrode contacts the target tissue.

MULTILAYER BOARD, PROBE UNIT, AND ULTRASOUND ENDOSCOPE
20230052510 · 2023-02-16 · ·

A multilayer board includes: a front-side layer; an intermediate layer; a back-side layer; the front-side layer; a first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board; a plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines; and a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.

MULTILAYER BOARD, PROBE UNIT, AND ULTRASOUND ENDOSCOPE
20230052510 · 2023-02-16 · ·

A multilayer board includes: a front-side layer; an intermediate layer; a back-side layer; the front-side layer; a first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board; a plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines; and a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.

TECHNOLOGIES FOR ACOUSTOELECTRONIC NANOTWEEZING
20230051277 · 2023-02-16 ·

Technologies for acoustoelectronic manipulation of micro/nano particles include a system having a piezoelectric substrate coupled to one or more acoustic transducers and a fluid layer positioned above the substrate. Micro/nano particles are introduced to the fluid, which can be in the form of a droplet or in a confined channel, and a signal is applied to the acoustic transducer. One or more parameters of the signal are varied after introducing the micro/nano particles into the fluid. The parameters may include amplitude, frequency, or phase of the signal. The system may include one or more acoustic transducers. Multiple signals may be applied to the acoustic transducers. Wave superposition of acoustic waves in the substrate manipulates micro/nano particles in the fluid. The nanoparticles may include carbon nanotubes, nanowires, nanofibers, graphene flakes, quantum dots, SERS probes, exosomes, vesicles, DNA, RNA, antibodies, antigens, macromolecules, or proteins.

Ultrasonic fingerprint sensor technologies and methods for bi-directional fingerprint sensing

Apparatuses, systems, and methods are provided for ultrasonic fingerprint sensors that are able to be used to detect fingerprints from opposing sides of an apparatus, e.g., a smartphone with screens on both sides of the housing. Some implementations of such sensors may include, for example, two piezoelectric and sensor pixel layer assemblies coupled to a common controller. Other implementations of such sensors may include, for example, a single piezoelectric and sensor pixel assembly coupled with a controller configured to apply a range-gate delay to obtain fingerprint scans from either opposing side of an apparatus. Yet further implementations of such sensors may include acoustic masking layers to spatially filter ultrasonic waves propagating to either side of an apparatus.

Piezoelectric micromachined ultrasound transducer device with multi-layer etched isolation trench
11577276 · 2023-02-14 · ·

A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a layer of piezoelectric material that is activated and sensed by an electrode and a conductive plane layer. The conductive plane layer may be electrically connected to processing circuitry by a via that extends through the piezoelectric layer. One or more isolation trenches extend through the conductive plane layer to isolate the conductive plane layer from other conductive plane layers of adjacent PMUT devices of a PMUT array.

Method of operating electro-acoustic transducers, corresponding circuit and device

A method of operating electro-acoustical transducers such as PMUTs involves applying to the transducer an excitation signal over an excitation interval, acquiring at the transducer a ring-down signal indicative of the ring-down behavior of the transducer after the end of the excitation interval, and calculating, as a function of said ring-down signal, a resonance frequency of the electro-acoustical transducer. A bias voltage of the electro-acoustical transducer can be controlled as a function of the resonance frequency. An acoustical signal received can be transduced into an electrical reception signal and a damping parameter of the electro-acoustical transducer can be calculated as a function of the ring-down signal so that a cross-correlation reference signal can be synthesized as a function of the resonance frequency and the damping ratio of the electro-acoustical transducer. Such a cross-correlation reference signal can be used for cross-correlation with the electrical reception signal to improve the reception quality.

Method of operating electro-acoustic transducers, corresponding circuit and device

A method of operating electro-acoustical transducers such as PMUTs involves applying to the transducer an excitation signal over an excitation interval, acquiring at the transducer a ring-down signal indicative of the ring-down behavior of the transducer after the end of the excitation interval, and calculating, as a function of said ring-down signal, a resonance frequency of the electro-acoustical transducer. A bias voltage of the electro-acoustical transducer can be controlled as a function of the resonance frequency. An acoustical signal received can be transduced into an electrical reception signal and a damping parameter of the electro-acoustical transducer can be calculated as a function of the ring-down signal so that a cross-correlation reference signal can be synthesized as a function of the resonance frequency and the damping ratio of the electro-acoustical transducer. Such a cross-correlation reference signal can be used for cross-correlation with the electrical reception signal to improve the reception quality.

Vibrator, piezoelectric actuator, piezoelectric motor, robot, electronic component conveyance apparatus, and manufacturing method of vibrator

A vibrator includes a vibrating part including a pair of vibrating plates and a piezoelectric material provided between the pair of vibrating plates, a supporting part including a pair of supporting plates and an interplate portion provided between the pair of supporting plates, and a wire provided in the vibrating part and the supporting part, wherein the wire is exposed from the supporting part.

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.