A TL/T tip is made by scaling down the dimensions of an L/T tip by the ratio of the TL/T frequency to the L/T frequency so that the TL/T tip can operate by excitement from a transducer at the same frequency that would have produced L/T motion in the L/T tip. A reductive resonator may be included between the transducer and the TL/T tip.

There is provided a an apparatus for manufacturing a display device. An apparatus for manufacturing a display device comprises a body generating ultrasonic vibration; and a horn including a horn body portion connected to the body and amplifying the ultrasonic vibration and a horn tip portion connected to the horn body portion and applying the ultrasonic vibration onto a bonding object, wherein the horn body portion includes at least one body groove surrounded by the horn body portion and completely penetrating the horn body portion in a thickness direction from the surface of the horn body portion.

A method for removing foreign substances from a camera system is provided. The camera system includes a camera device with a transparent cover having a piezoelectric component. First, a type of the foreign substances is identified based on temperature, an image captured by the camera system, and a voltage change of the piezoelectric component. A sequence of frequencies is applied to the piezoelectric component and a resonant frequency is acquired. Thereafter, the foreign substances are removed from the camera system. A vibration frequency and a vibration time period for the piezoelectric component are determined according to the identified type of the foreign substances. The vibration frequency is based on the resonant frequency. The piezoelectric component is driven with the vibration frequency and the vibration time period, such that at least a portion of the foreign substances are removed from the transparent cover through vibration of the piezoelectric component.

A method for removing foreign substances from a camera system is provided. The camera system includes a camera device with a transparent cover having a piezoelectric component. First, a type of the foreign substances is identified based on temperature, an image captured by the camera system, and a voltage change of the piezoelectric component. A sequence of frequencies is applied to the piezoelectric component and a resonant frequency is acquired. Thereafter, the foreign substances are removed from the camera system. A vibration frequency and a vibration time period for the piezoelectric component are determined according to the identified type of the foreign substances. The vibration frequency is based on the resonant frequency. The piezoelectric component is driven with the vibration frequency and the vibration time period, such that at least a portion of the foreign substances are removed from the transparent cover through vibration of the piezoelectric component.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

The present invention concerns an ultrasonic vibration system comprising a sonotrode which has two sonotrode end faces and a circumferentially extending lateral surface connecting the two sonotrode end faces together, wherein the sonotrode has an elongate core element and at least one wing element, wherein core element and wing element respectively extend from the one sonotrode end face to the other sonotrode end face in a longitudinal direction, wherein the wing element has a sealing surface which is provided to come into contact with a material for processing thereof and is connected to the core element by way of a plurality of webs spaced from each other in the longitudinal direction of the core element, and a converter which is optionally connected to the sonotrode by way of an amplitude transformer. According to the invention it is proposed that the ultrasonic vibration system is connected to a machine stand by way of a mounting connected to the lateral surface.

The present invention concerns an ultrasonic vibration system comprising a sonotrode which has two sonotrode end faces and a circumferentially extending lateral surface connecting the two sonotrode end faces together, wherein the sonotrode has an elongate core element and at least one wing element, wherein core element and wing element respectively extend from the one sonotrode end face to the other sonotrode end face in a longitudinal direction, wherein the wing element has a sealing surface which is provided to come into contact with a material for processing thereof and is connected to the core element by way of a plurality of webs spaced from each other in the longitudinal direction of the core element, and a converter which is optionally connected to the sonotrode by way of an amplitude transformer. According to the invention it is proposed that the ultrasonic vibration system is connected to a machine stand by way of a mounting connected to the lateral surface.

A proximity detection method for detecting absorptive and reflective proximal objects using ultrasound signals and an associated electronic device are provided. The electronic device includes an audio codec, and an acoustics module having a microphone and a speaker. The method includes the steps of: utilizing the speaker to emit an ultrasound signal encoded by the audio codec; utilizing the microphone to sense to generate an incoming ultrasound signal associated with the emitted ultrasound signal; decoding the incoming ultrasound signal into ultrasound waves; and analyzing the ultrasound waves to detect the proximity of a proximal object.

A proximity detection method for detecting absorptive and reflective proximal objects using ultrasound signals and an associated electronic device are provided. The electronic device includes an audio codec, and an acoustics module having a microphone and a speaker. The method includes the steps of: utilizing the speaker to emit an ultrasound signal encoded by the audio codec; utilizing the microphone to sense to generate an incoming ultrasound signal associated with the emitted ultrasound signal; decoding the incoming ultrasound signal into ultrasound waves; and analyzing the ultrasound waves to detect the proximity of a proximal object.