Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a filter in a vibrating sieve machine, the filter including a plurality of rods extending at distances in a feed direction of a raw material; and placing a raw material containing at least wire-form objects and plate-form objects onto the filter, and vibrating the filter to sieve out the wire-form objects under a sieve.

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters including a plurality of rods 2 extending at distances in the feed direction and a beam portion 21 for supporting the plurality of rods 2 at one ends 2a of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; and feeding a raw material containing at least wire-form objects and plate-form objects into the vibrating sieve machine 1; and vibrating the filters 3 to sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine 1.

Provided is a method for removing wire-form objects, a device for removing wire-form objects, and a method for processing electronic/electrical apparatus component waste, which can efficiently sort wire-form objects from sorting target objects having various shapes. The method for removing wire-form objects includes: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters including a plurality of rods 2 extending at distances in the feed direction and a beam portion 21 for supporting the plurality of rods 2 at one ends 2a of the plurality of rods 2, the other ends 2b of the plurality of rods 2 being free ends; and feeding a raw material containing at least wire-form objects and plate-form objects into the vibrating sieve machine 1; and vibrating the filters 3 to sieve out the wire-form objects toward an under-sieve side of the vibrating sieve machine 1.

An attachment for a shaker conveyor for sorting material having various sizes. The attachment includes a passageway bordered on opposite sides by a pair of walls. A first grate is disposed in the passageway. The first grate defines a first gap for sorting the material. The first grate borders a first compartment having a first outlet. A second grate is disposed in the passageway. The second grate defines a second gap having a dimension different than the first gap. The second grate borders a second compartment separate from the first compartment and leading to a second outlet.

A screening apparatus comprising a body, a drive system for imparting vibrations to the body, and screen media that is coupled to the body by a resilient coupling mechanism that allows oscillatory movement of the screen media with respect to the body. In response to vibration of the body, the resilient coupling mechanism causes the screen media to oscillate in a manner that is amplified with respect to the vibration of the body. The amplification may depend on the frequency of the vibrations of the body and/or on the mass of any material gathered on the screen media.

A screening apparatus comprising a body, a drive system for imparting vibrations to the body, and screen media that is coupled to the body by a resilient coupling mechanism that allows oscillatory movement of the screen media with respect to the body. In response to vibration of the body, the resilient coupling mechanism causes the screen media to oscillate in a manner that is amplified with respect to the vibration of the body. The amplification may depend on the frequency of the vibrations of the body and/or on the mass of any material gathered on the screen media.

The machine for integral processing of fruits with a hard or soft shell disclosed herein comprises a feed hopper and at least a first receptacle having a first end for connection to said hopper and a second opposite end. The receptacle is positioned horizontally according to the longitudinal direction of the machine and comprises in its interior a central shaft positioned in accordance to the longitudinal direction of the machine and connected at one end to a rotating element.

A sieving device is described. The sieving device includes an adjustable sieve surface that includes a first sieve surface and a second sieve surface. Openings are formed in each of the first sieve surface and the second sieve surface so as to define a shared pathways extending through the adjustable sieve surface. The shared pathways are defined by a length dimension that is greater than a width dimension. The width dimension can correspond to a cephalothorax width of an insect.

Provided is a method for removing a linear object, a device for removing a linear object, and a method for processing electronic/electrical equipment component waste, which can improve separation efficiency. The method for removing linear objects including: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters 3 comprising a plurality of rods 2 extending at distances in the feed direction of the raw material and a beam portion 21 supporting the plurality of rods 1 at one ends of the plurality of the rods 2, the other ends of the plurality of the rods 2 being free ends; arranging a guide 6 below a tip of one of the filters 3 located on a most downstream side in the feed direction; feeding the raw material containing at least linear objects and plate-form objects into the vibrating sieve machine 1; and sorting the linear objects and the plate-form objects by vibrating the filters 3, sieving the linear objects to an under-sieve side of the vibrating sieve machine 1, and capturing lumpy linear objects with the guide.