B08B1/50

CLEANING SYSTEMS FOR ADDITIVE MANUFACTURING APPARATUSES AND METHODS FOR USING THE SAME

Embodiments of the present disclosure are directed to additive manufacturing apparatuses, cleaning stations incorporated therein, and methods of cleaning using the cleaning stations.

System for cleaning wafer in CMP process of semiconductor manufacturing fabrication

A system for performing a Chemical Mechanical Polishing (CMP) process is provided. The system includes a CMP module configured to polish a semiconductor wafer. The system further includes a cleaning brush assembly configured to clean the semiconductor wafer. The cleaning brush includes a rotation shaft and a brush member surrounding a segment of the rotation shaft. The system also includes an agitation transducer arranged to be distant from the brush member and configured to produce an agitated cleaning liquid to clean the cleaning brush assembly.

Material and hardware to automatically clean flexible electronic web rolls

Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

Substrate treatment apparatus
10821483 · 2020-11-03 · ·

A substrate treatment apparatus includes a brush moving mechanism which moves a shaft to which a cleaning brush is attached. The brush body includes a substrate contact portion of a pillar-shaped portion. The substrate treatment apparatus further includes a correcting member and a relatively-positioning mechanism. When the correcting member is placed in a target position, a contact portion of the correcting member overlaps an object portion which is a combination of a design contact portion and a belt-shaped annular portion in an outer surface of a design pillar-shaped portion of a design body of a design brush. The contact portion is formed to have an inverted shape of the object portion of the design brush, and a portion of the contact portion, which corresponds to the belt-shaped annular portion, is a center-axis facing surface which faces a center axis of the shaft.

Pro Sponge Rejuvenator
20200337443 · 2020-10-29 ·

The Pro Sponge Rejuvenator is sponge cleaner for cleaning a plurality of used sponges, comprising: a liquid-tight container in which stems which extend from a platform toward a bottom of the container are oscillate-able to rub the sponges against the bottom by an oscillation means connected to the platform and supported by the bottom. The Pro Sponge Rejuvenator cleans sponges using a cleaning solution that is filtered with every sponge cleaning oscillation up/down stroke of the apparatus through the use of one-way flow valves under the sponges and a central tube with filter media. The Pro Sponge Rejuvenator is ideal for cleaning sponges and especially cosmetics makeup sponges.

Cleaning system for a polishing film

A cleaning system comprises a first cleaning tank, a carrying and moving unit, a first cleaning spray head, and a rolling brush unit. The carrying and moving unit is configured to move a polishing film to be cleaned into the first cleaning tank and hold the polishing film in the first cleaning tank. The first cleaning spray head is configured to spray a cleaning liquid on the polishing film held in the first cleaning tank. The rolling brush unit is configured to brush the polishing film while the first cleaning spray head sprays the cleaning liquid on the polishing film.

Gas-assisted scraping tool
10779698 · 2020-09-22 · ·

A gas-assisted scraping tool includes a housing having a blade support with a cavity that is connectable to a source of a pressurized gas; a blade attached to and extending forwardly of the blade support; and a diffuser attached to the blade support and spacing the blade from the cavity, the diffuser shaped to direct a stream of the pressurized gas from within the cavity lengthwise along the blade and distribute the pressurized gas transversely across a width of the blade, whereby material loosened by the blade is blown away from an end of the blade by the stream of the pressurized gas.

Mop cleaning system and method for cleaning a mop
10773279 · 2020-09-15 ·

A mop cleaning system has a mop basin having a floor and a drain, a chamber affixed to the mop basin in a location away from the drain, a water inlet opening within the interior volume of the chamber, and a water source connected to the water inlet. The water inlet is adapted to pass water in an area adjacent to a bottom of the chamber. The water source is adapted to pass water under pressure into the water inlet. The chamber is fixedly mounted to the floor of the mop basin. The chamber has an outlet located at above the water inlet.

METHOD AND APPARATUS FOR CLEANING PVA BRUSH
20200281347 · 2020-09-10 ·

A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.

CLEANING MEMBER ATTACHING PART, CLEANING MEMBER ASSEMBLY AND SUBSTRATE CLEANING APPARATUS

In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.