A method for reconditioning an endoscope in a reconditioning apparatus, the method including: connecting an interior of the endoscope to a leakage tester of the reconditioning apparatus; supplying the interior with a fluid at a predefined pressure; carrying out a reconditioning process using a rinsing liquid; monitoring the pressure in the interior of the endoscope during the reconditioning process; and identifying the endoscope as defective if a profile of the pressure deviates from a predefined pressure profile; wherein the predefined pressure profile is determined according to process parameters of the reconditioning process.

There is provided a cleaning method of a substrate processing apparatus comprising cleaning an inside of an exhaust pipe through which a gas of an inside of a processing container is exhausted. The cleaning the inside of the exhaust pipe includes: removing a deposit on a downstream side of an opening/closing valve in the exhaust pipe by supplying a first exhaust pipe cleaning gas containing fluorine to the downstream side of the opening/closing valve in the exhaust pipe in a state in which the opening/closing valve provided in a middle of the exhaust pipe is closed; and removing a deposit on an upstream side of the opening/closing valve in the exhaust pipe by supplying a second exhaust pipe cleaning gas not containing fluorine as a gas constituent element to the inside of the processing container in a state in which the opening/closing valve is opened.

The present disclosure provides coupling systems for use in industrial systems to removably couple one or more components to the industrial system. The coupling systems discussed herein employ a flexible sleeve in addition to one or more components. The flexible sleeve can have a component disposed therein. When pressure is applied to the flexible sleeve, the flexible sleeve constricts around the component, securing the component in the coupling system and thus to the industrial system. Once the component is secured, the industrial system executes one or more processes on the component. The coupling systems discussed herein can accommodate components of varying internal and external geometries as well as internal and/or external coatings and surface finishes.

There is provided a substrate processing apparatus which includes: an exhaust pipe configured to selectively discharge an exhaust gas generated by a substrate process to a first pipe or a second pipe; a liquid supply part configured to supply a cleaning liquid to the exhaust pipe; a discharge destination setting part configured to set a discharge destination of the exhaust gas to the first pipe or the second pipe by rotating the exhaust pipe; and a controller configured to control the discharge destination setting part to rotate the exhaust pipe. The controller is further configured to control the liquid supply part to supply the cleaning liquid to the rotating exhaust pipe.

A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.

There is provided a substrate processing apparatus which includes: an exhaust pipe configured to selectively discharge an exhaust gas generated by a substrate process to a first pipe or a second pipe; a liquid supply part configured to supply a cleaning liquid to the exhaust pipe; a discharge destination setting part configured to set a discharge destination of the exhaust gas to the first pipe or the second pipe by rotating the exhaust pipe; and a controller configured to control the discharge destination setting part to rotate the exhaust pipe. The controller is further configured to control the liquid supply part to supply the cleaning liquid to the rotating exhaust pipe.

Cleaning fixtures for cleaning a showerhead assembly are disclosure. The cleaning fixtures include: a fixture body incorporating three or more cavities, each cavity being separate from an adjacent cavity by a partition, and a number of channels associated with each cavity for fluidly connecting the cavities with an upper surface of the fixture body.

The present disclosure provides a surface cleaning apparatus that includes a housing including a base adapted for movement across a surface to be cleaned, a fluid delivery system, and a recovery system. The surface cleaning apparatus can be configured to clean multiple surfaces, including hard and soft surfaces, and for different cleaning modes, including wet cleaning, dry vacuum cleaning, and self-cleaning. Methods for self-cleaning a surface cleaning apparatus are also provided.

A cleaning apparatus for a vacuum exhaust system capable of preventing redeposition of deposits on a downstream side of a vacuum pump is provided. A cold trap capable of causing deposits to be formed by cooling gas containing a sublimation component, at least one first vacuum pump disposed upstream of the cold trap, at least one first piping connecting the first vacuum pump to the cold trap, at least one second vacuum pump disposed downstream of the cold trap, and at least one second piping connecting the second vacuum pump to the cold trap are provided. At least a part of the first vacuum pump or the first piping is configured to be heated to higher than or equal to a sublimation temperature of the sublimation component. The cold trap is configured to be cooled to less than or equal to the sublimation temperature of the sublimation component.

A system and method for treating a portion of a food flow path in a food processor having a freezer chamber includes imparting a continuous flow of solution through a portion of the food flow path with sufficient flow rate, temperature and flow duration to impart at least one of (i) impart at least a 6 log reduction in inoculum count and (ii) extend the necessary time for manual cleaning of the portion of a food flow path exposed to the continuous flow of solution to at least 7 days.