Patent classifications
B08B2220/01
A PROCESS FOR RECYCLING A LAMINATE AND A SOLUTION THEREFOR
The present invention relates to a recycling process for a laminate and a solution used in such a process. The present invention finds particular application in the removal of an adhered overlay from an underlying substrate material such as plastic. The process includes subjecting the laminate to an impact frictional striking force, thereby substantially separating the substrate layer from the one or more surface layers of the overlay and then washing the substrate layer with a washing solution to remove the remaining surface layers of the overlay and glue from the substrate layer. The washing solution may be an aqueous solution including a surfactant, a solvent and a base.
SELF-CLEANING AND ANTI-ADHESION APPARATUS FOR MARINE INSTRUMENTS
A self-cleaning and anti-adhesion apparatus for marine instruments includes an installation frame. A first end of the installation frame is fixed with an installation base, and a second end of the installation frame is movable with a screw rod. The upper end of the installation base is movable with a first rotation base. A wire netting ball used for holding a sensor is installed above the first rotation base. The wire netting ball is fixedly connected with the installation base. The top end of the screw rod is fixedly connected with a first end of the flexible connector, and a second end of the flexible connector is fixedly connected with a floating bladder. The screw rod is screwed with an inner wheel of an internal meshing ratchet mechanism, and an outer wheel of the internal meshing ratchet mechanism is fixed inside the mounting ring.
LABEL REMOVER APPARATUS AND USE THEREOF
An apparatus for removing material from an object including a support structure accommodating the object and a material remover supported by the support structure and biased against the material, wherein movement of the object relative to the material remover removes the material.
Adhesive removing device and method
Provided is an adhesive removing device for removing an adhesive for adhering a mask and a pellicle from the mask. The adhesive removing device includes: a laser irradiating unit configured to irradiate a laser beam to an adhesive layer formed between the mask and the pellicle; a controller configured to control a wavelength, a waveform, and an energy density of the laser beam, so as to remove the adhesive layer through emission of the laser beam; and an imaging unit configured to monitor a region to which the laser beam is irradiated.
Prescription bottle label degrader
A simple hand held label degrading device and method employs a molded polymer ring (collar) having a plurality of molded hardened pointed teeth on the internal circumference projecting radially inward for degrading the label of a prescription bottle or the like inserted therein. A longitudinal slot in the collar allows it to be fitted over a bottle such that simple hand squeezing of the collar compresses the collar around the bottle and engages the pointed teeth against the label. Simple hand twisting of the collar around the bottle in a clockwise or counterclockwise rotation cuts through the plastic composite or paper label and shreds the label rendering sensitive information illegible thus protecting personal health information. The bottles can then be thrown away or recycled without fear of medical identity theft.
METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE, METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE, AND STRIPPING COMPOSITION
A semiconductor substrate cleaning method including removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by any of formulae (L0) to (L4).
SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELING
The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition, wherein the remover composition contains a solvent but no salt; and the solvent includes an organic solvent represented by formula (L) (wherein each of L.sup.1 and L.sup.2 represents a C2 to C4 alkyl group, and L.sup.3 represents O or S) in an amount of 80 mass % or more.
L.sup.1-L.sup.3-L.sup.2(L)
Adhesive scoop having a rigid unitary form with plurality of fillets
A method and apparatus for removing a viscous material from a structure. The apparatus may comprise a base section. The base section may be configured to move along a surface of a first part and a second part of the structure. The base section may have sides that form a pocket. The sides may have a shape that substantially conforms to the surface of the first part and the second part of the structure.
METHOD FOR SEPARATING ADHESIVES
The present invention relates to a method in which an adhesive bond is brought into contact with a supercritical fluid, characterized in that the adhesive bond is based on one or more adhesives comprising crosslinked polymers, where the crosslinked polymers have at least one oxygen atom in the polymer chain and have been crosslinked via urethane bridges or —O—CH.sub.2—CH(OH)—CH.sub.2—O— bridges or molecular chains having corresponding bridges, and in that after bringing the adhesive bond into contact with the supercritical fluid, at least one of the parameters pressure, volume, amount of substance or temperature is changed such that the fluid transitions from the supercritical state into a different state, and also to the use of this method as at least a substep in a method for separating adhesive bonds of components.
CLEANING DEVICE
A cleaning device includes a supporting mechanism, a clamping mechanism arranged on the supporting mechanism and used to clamp a spray head, a heating mechanism, an adjusting mechanism, and a cleaning mechanism. The heating mechanism, the adjusting mechanism, and the cleaning mechanism are arranged on the supporting mechanism. The heating mechanism is used to heat the spray head clamped by the clamping mechanism. The cleaning mechanism is used to inject cleaning liquid into the spray head, dredge the spray head, and detect the spray head. The adjusting mechanism is used to rotate and adjust a position of the cleaning mechanism to complete different tasks on the spray head.