A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.

A substrate processing method includes forming a high surface tension liquid film by supplying high surface tension liquid on a substrate surface, replacing the high surface tension liquid film with low surface tension liquid by supplying the low surface tension liquid to a center area of a substrate so that the low surface tension liquid impinges on the high surface tension liquid film formed on the center area of the substrate, and supplying high surface tension liquid for a predetermined period of time during the supplying the low surface tension liquid.

A substrate processing device according to the present embodiment includes a processing tank configured to be capable of accumulating a liquid. A conveyer can array a plurality of semiconductor substrates in such a manner that front surfaces of the semiconductor substrates face a substantially horizontal direction, and transport the semiconductor substrates into the processing tank. A plurality of liquid suppliers can supply the liquid toward an inside of the processing tank from a lower portion of the processing tank. A plurality of current plates are arranged on at least either one end side or the other end side of an array of the semiconductor substrates. The current plates are provided in a first gap region above the semiconductor substrates in gaps between the conveyer and a sidewall of the processing tank on both sides of the conveyer as viewed from an array direction of the semiconductor substrates.

The invention relates to a treatment system for treating workpieces, in particular for cleaning and/or deburring, comprising at least one treatment device that has at least one treatment unit, which is configured to perform at least one treatment operation on the workpiece, as well as at least one receiving unit for accommodating the workpiece on or in the treatment device, a transport device that comprises at least one transport unit, with which the workpiece is transferable into a transfer position, from which the workpiece is transferable by means of the at least one receiving unit into a treatment position, as well as a control device for controlling the at least one treatment unit, the at least one receiving unit, and the at least one transport unit, wherein the at least one treatment device comprises two or more receiving units for accommodating a respective workpiece for transferring independently of one another into the treatment position, and wherein the control device controls the at least one treatment unit such that the workpieces are treated by said treatment unit in a time-offset manner according to a treatment operation of the same kind. The invention also relates to a method.

This method for cleaning wires enables effective descaling and removal of smuts from wires, prevents yellowing after cleaning, and significantly reduces the amount of water discharged as a result of cleaning, said method including, in the stated order: (A) pickling a wire; (B) cleaning the wire with acidic pressurized water, the concentration of which is adjusted with water and collected pickle solution which has adhered to and been recovered by the wire after use in Step (A); and (C) cleaning the wire with water.

A mop washing bucket has a container with an interior volume defined by a bottom and a wall extending upwardly from the bottom, a fluid inlet affixed adjacent to the bottom of the container, and a fluid outlet formed on the container in a location above the fluid inlet. The fluid inlet is adapted to be connected to a water hose. The fluid inlet extends through the wall of the container so as to have one end in the interior volume of the container and another end exterior of the wall of the container. The fluid outlet is adapted to allow water from the interior volume of the container to flow outwardly of the container.

A system and method for deglazing or defrosting items, for cleaning wares, and/or for thermalizing/rethermalizing food items. The system includes a tank for holding fluid and a wash pump for creating a rolling washing action within the wash tank. The method includes placing items into the fluid so that as the fluid rolls within the wash tank, the items become deglazed or defrosted. The system further includes a discharge manifold with a plurality of discharge jets, a flow balancer for equalizing flow to multiple sections of the tank, and a diffuser plate for equalizing flow within a section of the tank. The various components of the system can be removed for cleaning, inspection, and/or replacement. The discharge manifold is accessible for removal and is configured to be easily cleaned.

A system for and method of improving fluid flow is provided. The system includes a discharge manifold defining a primary flow path partially obstructed by one or more flow diverter. The flow diverter includes an obtrusion pair, each obtrusion of the obtrusion pair extending from a rear wall of the discharge manifold into an interior area of the discharge manifold, thereby creating a void along the primary flow path. The system further includes a first nozzle extending through the primary flow path and into the void such that a nozzle inlet of the first nozzle is positioned at least partially within the void. The system further includes a plurality of subsequent nozzles, each of the first and subsequent nozzles defining a respective secondary flow path for directing fluid away from the discharge manifold. The method includes utilizing obtrusion pairs to reduce or eliminate hydraulic skip.

A method and a system for cleaning a work, the sum A of the areas (mm.sup.2), the sum B of the areas (mm.sup.2) and the determined supply flow rate Q (L/min) or the supply flow rate Q (L/min) and one or both of the determined sum A of the areas (mm.sup.2) and the determined sum B of the areas (mm.sup.2) satisfy the predetermined relations.