A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

System for selectively contacting a cleaning composition with a surface of a turbine engine component is presented. The system includes a cleaning apparatus and a manifold assembly. The cleaning apparatus includes an upper portion and a lower portion defining a cleaning chamber configured to allow selective contact between the cleaning composition and a surface of the first portion of the turbine engine component. The upper portion includes a plurality of fill holes in fluid communication with the cleaning chamber, and the lower portion includes a plurality of drain holes in fluid communication with the cleaning chamber. The manifold assembly is configured to selectively circulate the cleaning composition from a reservoir to the cleaning chamber via the plurality of fill holes, and recirculate the cleaning composition from the cleaning chamber to the reservoir via the plurality of drain holes. Methods for selectively cleaning a turbine engine component is also presented.

System for selectively contacting a cleaning composition with a surface of a turbine engine component is presented. The system includes a cleaning apparatus and a manifold assembly. The cleaning apparatus includes an upper portion and a lower portion defining a cleaning chamber configured to allow selective contact between the cleaning composition and a surface of the first portion of the turbine engine component. The upper portion includes a plurality of fill holes in fluid communication with the cleaning chamber, and the lower portion includes a plurality of drain holes in fluid communication with the cleaning chamber. The manifold assembly is configured to selectively circulate the cleaning composition from a reservoir to the cleaning chamber via the plurality of fill holes, and recirculate the cleaning composition from the cleaning chamber to the reservoir via the plurality of drain holes. Methods for selectively cleaning a turbine engine component is also presented.

A sensor lens assembly includes a cylindrical sensor body including a lower surface, a sensor lens surface, and a side surface extending between the lower surface and an outer edge of the sensor lens surface, a sensor enclosed within the cylindrical sensor body and adjacent to the sensor lens surface, and a nozzle configured to deliver a fluid near a center point of the sensor lens surface. The sensor lens surface is concave and rotates relative to the side surface of the cylindrical sensor body such that centrifugal force causes the fluid to form a film on the sensor lens surface that acts as a barrier, cushion, and particle collecting medium on the sensor lens surface.

A sensor lens assembly includes a cylindrical sensor body including a lower surface, a sensor lens surface, and a side surface extending between the lower surface and an outer edge of the sensor lens surface, a sensor enclosed within the cylindrical sensor body and adjacent to the sensor lens surface, and a nozzle configured to deliver a fluid near a center point of the sensor lens surface. The sensor lens surface is concave and rotates relative to the side surface of the cylindrical sensor body such that centrifugal force causes the fluid to form a film on the sensor lens surface that acts as a barrier, cushion, and particle collecting medium on the sensor lens surface.

A cleaning apparatus includes a wash chamber, a platform and a lid. The platform is disposed in the chamber and sized to support an engine block. The lid has a first portion rotatably coupled to the wash chamber and a second portion rotatably coupled to the first portion. When the first portion of the lid is disposed in a position rotated distal to the wash chamber, the second portion of the lid is disposed in a position rotated proximal to the first portion of the lid. When the first portion of the lid is disposed in a position rotated proximal to the wash chamber, the second portion of the lid is disposed in a position rotated distal to the first portion of the lid.

A cleaning apparatus includes a wash chamber, a platform and a lid. The platform is disposed in the chamber and sized to support an engine block. The lid has a first portion rotatably coupled to the wash chamber and a second portion rotatably coupled to the first portion. When the first portion of the lid is disposed in a position rotated distal to the wash chamber, the second portion of the lid is disposed in a position rotated proximal to the first portion of the lid. When the first portion of the lid is disposed in a position rotated proximal to the wash chamber, the second portion of the lid is disposed in a position rotated distal to the first portion of the lid.

A chemical liquid treatment apparatus includes processing chambers; a chemical liquid feeding unit configured to cyclically feed a chemical liquid into the processing chambers; and a modifying unit. The modifying unit, when using a chemical liquid in which an effect thereof varies with a chemical liquid discharge time, is configured to calculate a variation of the effect of the chemical liquid based on the chemical liquid discharge time and is configured to modify the chemical liquid discharge time for each of the processing chambers based on the calculated variation of the effect of the chemical liquid and a cumulative time of the chemical liquid discharge time.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.