A method for automatically cleaning a probe card includes the following operations. A first wafer is tested in a chamber of a testing machine. A yield of the first wafer is monitored by a tool online monitor system (TOMS). An instruction file is transmitted by the TOMS to a tester, in which the instruction file compiles a first program code of the TOMS into a second program code of the tester. The second program code of the tester is received by the tester. A general purpose interface bus (GPIB) command is transferred to a testing machine by the tester. A cleaning operation is performed by the testing machine.

A debris collection and metrology system for collecting and analyzing debris from a tip used in nanomachining processes, the system including an irradiation source, an irradiation detector, an actuator, and a controller. The irradiation source is operable to direct incident irradiation onto the tip, and the irradiation detector is operable to receive a sample irradiation from the tip, the sample irradiation being generated as a result of the direct incident irradiation being applied onto the tip. The controller is operatively coupled to an actuator system and the irradiation detector, and the controller is operable to receive a first signal based on a first response of the irradiation detector to the sample irradiation, and the controller is operable to effect relative motion between the tip and at least one of the irradiation source and the irradiation detector based on the first signal.

A molecular adhesive system for reversibly joining two surfaces, comprising: an anionic coating on a first of two surfaces to be joined; a conductive polymer nanotube array on a second of the two surfaces to be joined; wherein said conductive polymer nanotube array is functionalized with metal nanoparticles; and an electric potential applied across said two surfaces.

A cleaning tool configured to be inserted into a lithography apparatus in a first configuration, configured to be engaged by a handler of the lithography apparatus, and used for cleaning a portion of the lithography apparatus. The cleaning tool is configured to move from the first configuration to a second, expanded configuration, after engagement by the handler such that the cleaning tool is in the second configuration when used for cleaning the portion of the lithography apparatus. There may also be a container configured to hold the cleaning tool in the first configuration and fit into the lithography apparatus. In that case, the cleaning tool is configured to be inserted into the lithography apparatus in the container, moved from the container by the handler for the cleaning, and returned to the container by the handler after the cleaning.

A backlight source packaging device is provided in the present disclosure, which belongs to the technical field of displays. The backlight source packaging device includes a bracket, a feeding mechanism, a cleaning mechanism, a cutting mechanism and a rotating mechanism, where the feeding mechanism is fixed to the bracket, which is configured to arrange a winding film; the cleaning mechanism is fixed to the bracket, which is configured to clean the winding film; the cutting mechanism is fixed to the bracket, which is configured to cut the winding film; the rotating mechanism is fixed to the bracket, which is configured to drive the backlight source to rotate so that the winding film winds around the backlight source, where the winding film can reach the rotating mechanism from the feeding mechanism successively through the cleaning mechanism and the cutting mechanism.

A handling equipment for a placement shelf of display panel is provided. The handling equipment includes a rack, a rotatable driving wheel and a cleansing device. The cleansing device is configured to cleanse the driving wheel. The driving wheel and the cleansing device both are disposed on the rack. The cleansing device contacts with the driving wheel. The driving wheel is configured to contact a bottom frame of the placement shelf of display panel. The driving wheel is disposed with a cleaning layer on the radial periphery of the driving wheel.

In an example of the disclosure, a blanket servicing system includes a rotatably mounted endless cleaning surface and a scraper. The endless cleaning surface is to have a first engagement with a blanket to obtain a layer of thermoplastic print agent from the blanket. The endless cleaning surface is to have a second engagement with the blanket to receive residue from the blanket onto the layer of thermoplastic print agent. The scraper is to scrape the endless cleaning surface to transfer the residue from the endless cleaning surface to a collection element.

Provided is a cleaning sheet including a cleaning layer that may be suitably used for a transfer member to be transferred in a substrate processing apparatus, the cleaning sheet being capable of effectively suppressing an adsorption error. A direction from an end portion of a surface of the cleaning layer toward a center thereof when viewed from a normal direction with respect to the surface is defined as a center direction, a region occupied by a width of 10 mm from the end portion toward the center direction in the surface is defined as an end portion region, and a maximum thickness L of the cleaning layer in the normal direction in the end portion region and an average thickness T of the cleaning layer in the normal direction in a region of the cleaning layer excluding the end portion region have a relationship of L−T≤5 μm.

A cleaning assembly may include a chuck. The cleaning assembly may include a plurality of lift pins positioned proximate to the chuck. The plurality of lift pins may be configured to engage a cleaning substrate and translate the cleaning substrate to allow the cleaning substrate to capture one or more particles from the surface of the chuck via at least one of electrostatic attraction or mechanical trapping when the cleaning substrate is positioned in the second position. The cleaning assembly may include a replaceable top skin coupled to the chuck and configured to capture the one or more particles.

A pre-loaded cleaning substrate, and related systems and methods for picking up particles with an aspect ratio (L/D) greater than 300 (e.g., hair), or greater than 1200 (e.g., particularly long hairs). The substrate (e.g., a nonwoven) may include only a single layer of material. The pre-loaded substrate is loaded (e.g., during manufacture) with a cleaning composition. The fibers of the substrate may have an average diameter less than 15 μm, the substrate may have an air permeability of 35 ft.sup.3/min to 75 ft.sup.3/min, and the liquid cleaning composition may have a surface tension of less than about 50 dynes/cm. Together, the combination of the particular substrate and cleaning composition may facilitate markedly improved ability to pick up high L/D aspect ratio particle debris (e.g., such as hair), while retaining such particles (e.g., providing hair retention index values of at least 20).