An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

The invention provides a light guide element comprising a light guide and a layer element, wherein the light guide comprises a light guide face and wherein the layer element comprises an optical layer, wherein said optical layer is in contact with at least part of the light guide face, wherein the optical layer has a first index of refraction (n1) smaller than the refractive index of seawater, wherein the light guide comprises a UV radiation transmissive light guide material.

Provided are a wafer cleaning apparatus based on light irradiation capable of effectively cleaning residue on a wafer without damaging the wafer, and a wafer cleaning system including the cleaning apparatus. The wafer cleaning apparatus is configured to clean residue on the wafer by light irradiation and includes: a light irradiation unit configured to irradiate light onto the wafer during the light irradiation; a wafer processing unit configured accommodate the wafer and to control a position of the wafer such that the light is irradiated onto the wafer during the light irradiation; and a cooling unit configured to cool the wafer after the light irradiation has been completed. The light irradiation unit, the wafer processing unit, and the cooling unit are sequentially arranged in a vertical structure with the light irradiation unit above the wafer processing unit and the wafer processing unit above the cooling unit.

A cleaning method is provided. In the cleaning method, residues of elements of a group for a common semiconductor material in a chamber are removed with plasma of a halogen-containing gas. Residues of metal elements of groups 12 and 13 and groups 14 and 15 in the chamber are removed with plasma of a hydrocarbon-containing gas. A C-containing material in the chamber is removed with plasma of an O-containing gas. Further, the removing with the plasma of the halogen-containing gas, the removing with the plasma of the hydrocarbon-containing gas, and the removing with the plasma of the O-containing gas are performed in that order or the removing with the plasma of the hydrocarbon-containing gas, the removing with the plasma of the O-containing gas, and the removing with the plasma of the halogen-containing gas are performed in that order X times where X≥1.

Disclosed is an optical window cleaning device, including: a cleaning brush; and a wiper arm. The wiper arm includes a first link, a torsion mechanism, a second link and a wiper arm drive system. A second end of the first link is hinged to a first end of the second link. The cleaning brush is hinged to a first end of the first link, a rotation trajectory of the cleaning brush and a rotation trajectory of a hinge joint between the second end of the first link and the first end of the second link are both located in a first plane. A rotation trajectory of the second link and the rotation trajectory of the hinge joint are located in the first plane. The torsion mechanism provides the first link and the second link with a force that rotates the first link relative to the second link.

A bed pan sanitizing assembly includes a housing and a pair of trays wherein each of the trays is positioned within the housing. Each of the trays can have a respective one of a bed pan and a urine bottle positioned thereon. A pair of light emitting units is positioned within the housing to emit light into an interior of the housing. Each of the light emitting units has an operational frequency within the ultraviolet spectrum to sterilize the bed pan and the urine bottle when the light emitting units are turned on. A heating unit is integrated into the housing to heat the interior of the housing when the heating unit is turned on for enhancing sterilizing the bed pan and the urine bottle.

A cleaning method applied in semiconductor manufacturing is provided. The method includes: receiving a substrate having a surface; identifying a location of a particle on the surface of the substrate; moving a cleaning apparatus toward the location of the particle; performing a cleaning operation, thereby removing the particle by spraying a cleaning liquid from the cleaning apparatus flowing against gravity and toward the surface of the substrate; detecting the surface of the substrate; and performing a second cleaning operation when a cleaning result of the detection is not acceptable. A semiconductor manufacturing method and a system for cleaning a substrate are also provided.

An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.

A cooling apparatus (1) for cooling a fluid withsurface water, comprising at least one tube (8) for containing and transporting the fluid in its interior, the exterior of the tube (8) being in operation at least partially submerged in the surface water so as to cool the tube (8) to thereby also cool the fluid. The cooling apparatus (1) further comprises at least one light source (9) for producing light that hinders fouling on the submerged exterior, wherein the light source (9) is dimensioned and positioned with respect to the tube (8) so as to cast anti-fouling light over the tube's exterior. By this structure anti-fouling of the cooling apparatus (1) can be assured in an alternative and effective manner.

A cooling apparatus for cooling a fluid by means of surface water, the cooling apparatus comprising more than one tubes for containing and transporting the fluid in its interior, the exterior of the tube being in operation at least partially submerged in the surface water so as to cool the tube to thereby also cool the fluid and hence different tube portions contain fluid at different temperatures. The cooling apparatus further comprises at least one light source for producing light that hinders fouling on the submerged exterior, wherein the at least one light source is arranged so that the intensity of the anti-fouling light, cast over the exterior of the tube portions whose exterior temperature or the temperature of the fluid they contain is below 80° C., is higher than the intensity of the anti-fouling light cast over the other tube portions. By this structure anti-fouling of the cooling apparatus can be assured in an effective manner.