A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate being cleaned. Normally, if f.sub.1=f.sub.2, then P.sub.2 is equal to zero or much less than P.sub.1; if P.sub.1=P.sub.2, then f.sub.2 is higher than f.sub.1; if the f.sub.1<f.sub.2, then, P.sub.2 can be either equal or less than P.sub.1.

In one embodiment, a system includes an inlet grid configured to reduce distortion of an incoming airflow. The system may also include a vibration device coupled to the inlet grid and a controller communicatively coupled to the vibration device. The controller may transmit a vibration signal to the vibration device causing the vibration device to vibrate the inlet grid such that the inlet grid resonates at a natural frequency inducing a mode shape in the inlet grid. The mode shape may break up and prevent ice on the inlet grid.

In one embodiment, a system includes an inlet grid configured to reduce distortion of an incoming airflow. The system may also include a vibration device coupled to the inlet grid and a controller communicatively coupled to the vibration device. The controller may transmit a vibration signal to the vibration device causing the vibration device to vibrate the inlet grid such that the inlet grid resonates at a natural frequency inducing a mode shape in the inlet grid. The mode shape may break up and prevent ice on the inlet grid.

Various embodiments of the invention include an apparatus for removing particulates from the surface of a 3D printed workpiece. Various particular embodiments include a material removal apparatus having: an enclosure having a first inlet and a first outlet; a rotatable platform contained within the enclosure for positioning a 3D printed workpiece having particulate on a surface thereof; a pressurized fluid applicator connected to the first inlet and configured to selectively apply a pressurized fluid to the 3D printed workpiece; a vibration source configured to apply an adjustable vibratory frequency to at least one of the rotatable platform or the 3D printed workpiece; and a material reclamation unit connected to the first outlet configured to collect a material removed from the 3D printed workpiece.

Various embodiments of the invention include an apparatus for removing particulates from the surface of a 3D printed workpiece. Various particular embodiments include a material removal apparatus having: an enclosure having a first inlet and a first outlet; a rotatable platform contained within the enclosure for positioning a 3D printed workpiece having particulate on a surface thereof; a pressurized fluid applicator connected to the first inlet and configured to selectively apply a pressurized fluid to the 3D printed workpiece; a vibration source configured to apply an adjustable vibratory frequency to at least one of the rotatable platform or the 3D printed workpiece; and a material reclamation unit connected to the first outlet configured to collect a material removed from the 3D printed workpiece.

The present disclosure relates, according to some embodiments, to methods, systems, and apparatuses for dewatering solid particles in a liquid mixture, such as those, for example, comprising receiving a liquid mixture, the liquid mixture including solid particles; suspending a filter in the liquid mixture; agglomerating, at the filter, solid particles in the liquid mixture, the agglomerating including potentiating passage of liquid in the liquid mixture through the filter and potentiating accumulation of solid particles in the liquid mixture to collect and agglomerate at the filter; and applying a shockwave to the filter, the applied shockwave operable to remove the agglomerated solid particles from the filter.

The present disclosure relates, according to some embodiments, to methods, systems, and apparatuses for dewatering solid particles in a liquid mixture, such as those, for example, comprising receiving a liquid mixture, the liquid mixture including solid particles; suspending a filter in the liquid mixture; agglomerating, at the filter, solid particles in the liquid mixture, the agglomerating including potentiating passage of liquid in the liquid mixture through the filter and potentiating accumulation of solid particles in the liquid mixture to collect and agglomerate at the filter; and applying a shockwave to the filter, the applied shockwave operable to remove the agglomerated solid particles from the filter.

A monitoring system includes an implantable intra-vascular support device for positioning against a vessel wall and an implantable sensor-actuator mounted to the support device. The sensor-actuator is drivable between a non-deployed position in which it is against the support device and a deployed position in which it is displaced away from the support device. Sensor signals are generated when in the deployed position. This system is able to monitor flow away from the edge of a vessel by deploying the sensor-actuator towards the center of the vessel. When flow monitoring does not need to take place, it can be non-deployed so that it does not present an occlusion to the flow.

A monitoring system includes an implantable intra-vascular support device for positioning against a vessel wall and an implantable sensor-actuator mounted to the support device. The sensor-actuator is drivable between a non-deployed position in which it is against the support device and a deployed position in which it is displaced away from the support device. Sensor signals are generated when in the deployed position. This system is able to monitor flow away from the edge of a vessel by deploying the sensor-actuator towards the center of the vessel. When flow monitoring does not need to take place, it can be non-deployed so that it does not present an occlusion to the flow.

A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.