A remotely positioned, ultrasonic wave producing, and low voltage anti-fouling system comprising; a computing module, a mounting system having a first end and a second end, wherein the first end is attached to vessel or a structure, a substantially waterproof enclosure detachably engaged with the second end of the mounting system, at least one transducer positioned within the substantially waterproof enclosure and cooperatively connected to the computing module, wherein the at least one transducer produces a sound wave able to impinge upon a submerged surface, at least one wave form generator cooperatively connected to the computing module and the at least one transducer, at least one power amplifier cooperatively connected to the at least one wave form generator and the at least one transducer, and at least one sensor cooperatively connected to the computing module, wherein the at least one sensor substantially.

Self-cleaning device and method using electrical oscillation and mechanical oscillation are disclosed. The self-cleaning device comprises at least one first electrode disposed on a solid material layer, a first dielectric layer disposed on the first electrode, a hydrophobic layer disposed on the first dielectric layer and at least one mechanical oscillation unit. Here, electrical oscillation for oscillating a droplet in a horizontal direction is generated by applying a first electric signal to the first electrode, thereby merging the droplets formed on the hydrophobic layer, and the mechanical oscillation unit moves the merged droplets in a specific direction or atomizes the merged droplets to remove the merged droplets by generating mechanical oscillation for oscillating the droplet in a vertical direction.

A process of using a chemical gel cleaning formulation to clean a cooling tower fill, comprising the steps of applying a pre-rinse fluid to the fill; applying the chemical gel cleaning formulation to the fill, wherein the chemical gel cleaning formulation includes glycerin, at least one polysaccharide, at least one corrosion inhibitor, at least one surfactant, and at least one acid; applying a descaling fluid to the fill; applying a neutralizer solution to the fill to neutralize the pH of residual fluid on the fill surface; and rinsing the fill with a rinsing fluid to remove residual chemical gel cleaning formulation and descaling fluid, residual neutralizer solution, and dissolved deposits from the fill.

Disclosed are a CMP wafer cleaning apparatus, and a wafer transfer manipulator and a wafer overturn method for same. The wafer transfer manipulator includes: a transverse transfer shaft, with same only being located at a side of a cleaning unit; a transverse transfer carriage provided on the transverse transfer shaft, and capable of transversely moving along the transverse transfer shaft; a first vertical lifting shaft provided on the transverse transfer carriage, and capable of vertically moving on the transverse transfer carriage; a rotary table provided on the first vertical lifting shaft; and a first claw clamping arm connected to the rotary table, and driven by the rotary table to move in a rotational manner. The CMP wafer cleaning apparatus is provided, and when the CMP wafer cleaning apparatus fails, safe storage of a polished wafer can be realized.

A pipe cleaning robotic device for sludge removal and suction and discharge includes a rail having a plurality of receiving grooves spaced at a predetermined distance on one side thereof; a fixed unit formed at an end of the rail, inserted into a pipe, and fixed in contact with an inner peripheral surface of the pipe; a driving unit mounted on the rail and movable in forward and backward directions along the rail by a wheel drive rotated by an external power; a cylindrical frame for moving and rotating in the forward and backward directions according to driving of the wheel drive; and a sound wave generator formed on one side of an outer circumference of the frame to generate a sound wave to remove the sludge in the pipe cleaning robotic device.

One of the problems is the reduction in interior areas and surfaces where various types of devices can be mounted. To address this issue more and more of these devices are being integrated with the glazing. Laminated glazing is especially suitable for thin devices. Today, laminated glazing is produced with heating elements, antennas, lighting, touch sensors, RFID, electronic blinds and other types of devices integrated as a permanent part of the glazing. The invention comprises an automotive laminate with a thin integrated electroacoustic transducer integrated in the glazing.

A modular sonic vibration buffer system includes an adapter assembly that can be attached to a sonic vibration device. The adapter assembly includes a body with apertures and a plate with arms that are received in the apertures of the body to couple the plate to the body. A cleaning tool is secured between the body and the plate to couple the cleaning tool to the adapter assembly. The sonic vibration device is operable to vibrate the cleaning tool via the adapter assembly. The system also includes additional adapter assemblies and cleaning tools with different characteristics that are attachable to the sonic vibration device in a modular nature for different cleaning or buffering applications.

A system for removing a coating from an underlying layer can include a wave-based weakening system configured to weaken the coating by decreasing a coupling force between the coating and the substrate, a coating removal mechanism configured to remove the weakened coating from the underlying layer, and a sensor configured to determine a property associated with the coating. A method for removing a coating from an underlying layer can include generating a weakened coating and removing the weakened coating.

A reusable apparatus, such as a medical instrument or tool, is decontaminated by applying at least one of pressure waves, shockwaves, and ultrasound waves in a sufficient dosage to remove contamination but without adversely affecting the ability to reuse the apparatus.

A method for cleaning an object having a surface, the method including steps of (1) delivering acoustic waves to the object to dislodge debris from the surface; (2) delivering a cleaning medium to the surface to collect dislodged debris; (3) delivering the acoustic waves to the object to acoustically treat and atomize the cleaning medium and the dislodged debris; (4) applying a vacuum airflow to collect atomized cleaning medium and dislodged debris; (5) delivering a rinsing medium to the surface; (6) delivering the acoustic waves to the object to acoustically treat and atomize the rinsing medium; and (7) applying the vacuum airflow to collect atomized rinsing medium.