A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

The present application provides a device for disassembling electronics, the device comprising transporting means (4) and/or holding means (5) arranged to receive one or more objects containing one or more electronic components, the holding means (5) being adjustable, imaging means (3) for imaging the object and/or measuring means for measuring the object, one or more removal means (6) for removing one or more electronic components from the object, the means being operatively connected to a control unit (1). The present application also provides a method for disassembling electronics with the device.

Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.

A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes (a) a grinder configured to grind a bulk compound material into an initial mixture of tiny particles; (b) a preimpact separator configured to separate the particles into two groups based on their respective mechanical properties, one group being a preimpact mixture comprising the compound particles; (c) a kinetic impactor configured to impact, via an acoustic shockwave, the compound particles of the preimpact mixture, thereby creating a postimpact mixture comprising (i) subparticles of 1.sup.st-constituent-material and (ii) reduced-compound particles comprising a 2nd constituent material; and (d) a postimpact separator configured to separate the reduced compound particles from the postimpact mixture based on a mechanical property.

A green resource-based method of thermal mass synergy in waste Integrated circuit board mainly includes carbonization cracking system, crushing and separation system, gasification cracking system and heat value utilization and comprehensive recovery system. Compared with existing techniques, carbonization cracking system can realize the dry distillation cracking of organic matter in waste integrated circuit board which converts carbon, hydrogen and other elements into fuel carbonized cracking gas and cracking oil, the heat from the combustion of the carbonization cracking gas of the invention provides the energy needed for the carbonization cracking to realize self-heating carbonization cracking. Carbonization cracking products are cracked and separated to solve the problems such as hard to break and organic coating metal caused by direct crushing and separation of traditional circuit boards which Improves crushing and separation effect; gasification cracking system achieves the comprehensive utilization of carbon, the gasified cracking gas can be used as a heat source for subsequent valuable metal recovery to further improve the utilization rate of calorific value. The invention has the characteristics of: high heat value utilization rate, low energy consumption, high metal recovery rate, short process recovery of valuable metal and no pollution of flue gas.

A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

The present invention is related generally to recovering metals from waste electronics, and more particularly to a process to recover copper and gold commonly found in waste printed circuit boards using a lixiviant containing a weak acid such as citric acid or acetic acid, a particular concentration of table salt and an oxidizer. By using this lixiviant, the copper found in the printed circuit board reacts to form copper salts and gold becomes detached. Importantly this recovery method of copper and gold found in waste PCBs is fast, does not pose environmental hazards and is economically feasible.

The present invention is related generally to recovering metals from waste electronics, and more particularly to a process to recover copper and gold commonly found in waste printed circuit boards using a lixiviant containing a weak acid such as citric acid or acetic acid, a particular concentration of table salt and an oxidizer. By using this lixiviant, the copper found in the printed circuit board reacts to form copper salts and gold becomes detached. Importantly this recovery method of copper and gold found in waste PCBs is fast, does not pose environmental hazards and is economically feasible.