Disclosed are a copper-cobalt-silicon-iron-phosphorus (Cu—Co—Si—Fe—P)-based alloy having strength, electrical conductivity, and excellent bending formability, and a method for producing the alloy. The copper alloy contains 1.2 to 2.5% by mass of cobalt (Co); 0.2 to 1.0% by mass of silicon (Si); 0.01 to 0.5% by mass of iron (Fe); 0.001 to 0.2% by mass of phosphorus (P); a balance amount of copper (Cu); unavoidable impurities; and optionally, 0.05% by mass or smaller of each of at least one selected from a group consisting of nickel (Ni), manganese (Mn) and magnesium (Mg), wherein a ratio between cobalt (Co) mass and silicon (Si) mass meets a relationship: 3.5≤Co/Si≤4.5, wherein a ratio between iron (Fe) mass and phosphorus (P) mass meets a relationship: 1.0<Fe/P. A bimodal structure improves the bending formability while maintaining the electrical conductivity and strength.

Disclosed are a copper alloy strip having high heat resistance and thermal dissipation properties which is suitable for a material for shield cans to solve heating of mobile devices, a material for vehicles and semiconductor lead frames, and a material for electrical and electronic parts, such as connectors, relays, switches, etc., widely used in industries including vehicles, and a method of preparing the same.

Described herein are thin metal strips having hot rolled exterior side surfaces characterized as being primarily or substantially free of all prior austenite grain boundaries, or at least primarily or substantially free of all prior austenite grain boundaries, and including elongated surface structure. As a result, because the prior austenite grain boundaries are not primarily or substantially present, all such prior austenite grain boundaries are not susceptible to grain boundary etching due to acid etching or pickling. In particular examples, the thin metal strips undergo hot rolling performed with a coefficient of friction equal to or greater than 0.20 with or without use of lubrication.

Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.

A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a β′ phase and a γ phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.

A large-width cathode roller for producing high-strength ultra-thin copper foil includes titanium side plates and a titanium cylinder sealed by the titanium side plates, and a cathode roller core penetrated through the titanium side plates. Steel-copper explosive clad cylinders and a steel support plate are disposed in/on the side plate, inner ring surfaces of the side plates and the copper plates are connected to a copper sleeve around the cathode roller core, outer ring surfaces of the copper plates and the steel support plates are connected to a copper cylinder, inner ring surfaces of the steel support plates are connected to the cathode roller core; and multiple electrically conductive support rings on the copper cylinder are connected to the copper plates on two sides through the electrically conductive copper bars to form a conducting loop to improve the distribution uniformity of the current on the surface of the cathode roller.

Provided is a rolled copper foil for a lithium ion battery current collector, which has good adhesion to a negative electrode active material, generates less metal powder during ultrasonic welding, and has a rust prevention property. In the rolled copper foil for a lithium ion battery current collector, a surface of the copper foil has a BTA film, the BTA film has a thickness of 0.6 nm or more and 4.6 nm or less, and the rolled copper foil satisfies the following relationships: 40≤wet tension [mN]/m]+thickness of BTA film [nm]×10≤80; 0.01≤arithmetic average roughness Ra [μm]≤0.25; and wet tension [mN/m]≥35.

Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material satisfies the relationship: A.sup.0/A≤1.000, in which A.sup.0 represents a projected area of an indentation remaining after carrying out a Vickers hardness test by maintaining a square pyramidal indenter for 10 seconds while applying a test force with a load of 1 kg to a surface of a base material and releasing the test force; and A represents an area connecting vertices of the indenter, and wherein the rolling material satisfies the relationship: 0.1≤I.sub.(200)/I.sub.0(200)<1.0, in which I.sub.(200) represents an X-ray diffraction intensity from a (200) plane on the surface, and I.sub.0(200) represents an X-ray diffraction intensity from a (200) plane of a pure copper powder standard sample.

Disclosed are a copper alloy strip having high heat resistance and thermal dissipation properties which is suitable for a material for shield cans to solve heating of mobile devices, a material for vehicles and semiconductor lead frames, and a material for electrical and electronic parts, such as connectors, relays, switches, etc., widely used in industries including vehicles, and a method of preparing the same.