The present invention concerns a method for manufacturing a metal workpiece by casting a metal alloy in a mould, wherein prior to the casting, a chart is determined providing a risk of appearance of recrystallised grains during the casting/solidification of the metal workpiece, depending on temperature and plastic deformation energy conditions undergone by said metal workpiece, the casting of the metal alloy in the mould being implemented under casting and solidification conditions determined using the chart in order for the temperature and plastic deformation energy conditions undergone by the metal workpiece to be less than a given threshold for the risk of appearance of recrystallised grains.

The present invention concerns a method for manufacturing a metal workpiece by casting a metal alloy in a mould, wherein prior to the casting, a chart is determined providing a risk of appearance of recrystallised grains during the casting/solidification of the metal workpiece, depending on temperature and plastic deformation energy conditions undergone by said metal workpiece, the casting of the metal alloy in the mould being implemented under casting and solidification conditions determined using the chart in order for the temperature and plastic deformation energy conditions undergone by the metal workpiece to be less than a given threshold for the risk of appearance of recrystallised grains.

Methods for creating a cast component, along with the resulting cast components, are provided. The method may include heating a mold having a cavity therein; supplying a first molten metal material into the cavity of the mold such that the first molten metal material is directed to a first portion of the cavity of the mold; supplying a second molten metal material into the cavity of the mold such that the second molten metal material is directed to a second portion of the cavity of the mold, wherein the first molten metal material is compositionally different than the second molten metal material; and thereafter, allowing the first molten metal material and the second molten metal material to form the cast component.

Methods for creating a cast component, along with the resulting cast components, are provided. The method may include heating a mold having a cavity therein; supplying a first molten metal material into the cavity of the mold such that the first molten metal material is directed to a first portion of the cavity of the mold; supplying a second molten metal material into the cavity of the mold such that the second molten metal material is directed to a second portion of the cavity of the mold, wherein the first molten metal material is compositionally different than the second molten metal material; and thereafter, allowing the first molten metal material and the second molten metal material to form the cast component.

Cast components are provided that include a first section comprising a first metal material and having first grains with a first average grain size and a second section comprising a second metal material and having second grains with a second average grain size.

Cast components are provided that include a first section comprising a first metal material and having first grains with a first average grain size and a second section comprising a second metal material and having second grains with a second average grain size.

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.

Amorphous metals are a new class of materials in which advantageous physical properties can be achieved. Amorphous metals require rapid cooling in the injection-molding process, which is not achieved in the case of a large number of geometries. The invention relates to a method for adapting a component description of a workpiece to be produced with amorphous properties, which method comprises: —defining a cooling behaviour of at least a part of a workpiece to be produced, taking account of a component description of the workpiece; —adapting at least a part of the component description, taking account of the defined cooling behaviour of the workpiece.

Methods for creating a cast component, along with the resulting cast components, are provided. The method may provide for a controlled grain structure in the resulting cast component. The methods may include heating at least a first portion mold under controlled conditions, such as when the first portion of the mold is buried in a ceramic powder.