The present application provides a 3D printing method. The present application can provide as a method for efficiently performing 3D printing, for example, a 3D printing method capable of more rapidly and efficiently producing a three-dimensional shape precisely realized up to a fine portion.

The present application provides a 3D printing method. The present application can provide as a method for efficiently performing 3D printing, for example, a 3D printing method capable of more rapidly and efficiently producing a three-dimensional shape precisely realized up to a fine portion.

Methods of making metal objects are provided. These methods generally involve adding a metal powder slurry into a sacrificial mold, such as a mold made by three dimensional printing, and heating the slurry/mold mixture. The heating steps may include curing the slurry to make a green part inside the mold, debinding to burn off the mold and binder to make a brown part, sintering, and hot isostatic pressing. Metal products, such as aircraft engine parts, are also provided.

A binder for an injection moulding composition, the binder includes, in percentage by mass and for a total of 100%: 35% to 60% of a component (a), or polymer base, made of a polymer or a mixture of polymers, each of the polymer being non-amphiphilic and having a mass average molar mass greater than or equal to 5,000 g/mol, 30% to 55% of a component (b), or wax, made of a polymer or a mixture of polymers, each of the polymer being non-amphiphilic and having a mass average molar mass less than 5,000 g/mol, and less than 10% of an amphiphilic component (c), or surfactant, and less than 10% of other components (d). The polymer base comprising 2% to 15% of a styrene-ethylene-butylene-styrene copolymer (SEBS), in percentage by mass based on the mass of the binder.

This paste composition includes silver particles (A), a thermosetting resin (B), a curing agent (C), and a solvent (D). A shrinkage rate after curing of the paste composition is 15% or less.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

A soft magnetic powder contains a particle having a composition represented by Fe.sub.xCu.sub.aNb.sub.b(Si.sub.1-yB.sub.y).sub.100-x-a-b, and 0.3≤a≤2.0, 2.0≤b≤4.0, and 72.5≤x≤75.5, and y is a number satisfying f(x)≤y≤0.99, and f(x)=(4×10.sup.−34)×17.56. The particle includes a crystal grain having a grain size of 1.0 nm to 30.0 nm, a Cu segregation portion, and a crystal grain boundary. A content proportion of the crystal grain is 30% or more. When the Cu segregation portion positioned in a surface layer portion and having a grain size of 1.0 nm to 5.0 nm is referred to as a first Cu segregation portion, and the Cu segregation portion positioned in an inner portion and having a grain size of 3.0 nm to 10.0 nm is referred to as a second Cu segregation portion, a number proportion of the first Cu segregation portion is 80% or more, and a number proportion of the second Cu segregation portion is 80% or more.

Methods for fabricating a multi-material composite structure are described. Methods for fabricating a multi-material composite structure include forming a first colloidal ink solution with a first material matrix, water, and a rheology modifying agent; forming a second colloidal ink solution with a second material matrix, water, and a rheology modifying agent; printing a first layer on a substrate using a first printing nozzle carrying the first colloidal ink solution; printing a second layer on top of the first layer using a second printing nozzle carrying the second colloidal ink solution; forming a 3D structure by printing a plurality of layers including the first layer and the second layer printed in an alternating pattern; and sintering the 3D structure to form the multi-material composite structure.

Methods for fabricating a multi-material composite structure are described. Methods for fabricating a multi-material composite structure include forming a first colloidal ink solution with a first material matrix, water, and a rheology modifying agent; forming a second colloidal ink solution with a second material matrix, water, and a rheology modifying agent; printing a first layer on a substrate using a first printing nozzle carrying the first colloidal ink solution; printing a second layer on top of the first layer using a second printing nozzle carrying the second colloidal ink solution; forming a 3D structure by printing a plurality of layers including the first layer and the second layer printed in an alternating pattern; and sintering the 3D structure to form the multi-material composite structure.