Patent classifications
B22F2003/1042
Method for forming 3D printed objects with multi-layer rafts which optimize shrinkage
Systems and methods for forming an object using additive manufacturing. One method includes receiving a digital model of the object, predicting a shrinking characteristic or receiving a predicted shrinking characteristic of the object that will occur during thermal processing of the object, once formed, and generating, based on the shrinking characteristic of the object, instructions for forming a raft on which the object will be formed. The instructions for forming the raft are configured to form a raft having a shrinking characteristic that reflects the shrinking characteristic of the object.
Method for forming 3D printed objects with multi-layer rafts which optimize shrinkage
Systems and methods for forming an object using additive manufacturing. One method includes receiving a digital model of the object, predicting a shrinking characteristic or receiving a predicted shrinking characteristic of the object that will occur during thermal processing of the object, once formed, and generating, based on the shrinking characteristic of the object, instructions for forming a raft on which the object will be formed. The instructions for forming the raft are configured to form a raft having a shrinking characteristic that reflects the shrinking characteristic of the object.
SINTERING METHOD, MANUFACTURING METHOD, OBJECT DATA PROCESSING METHOD, DATA CARRIER AND OBJECT DATA PROCESSOR
A method is provided of sintering a green object body to form a manufactured object. The method comprises providing a green object body. The green object body comprises granular construction material bound together by a binder. The method comprises providing a green support body for supporting the green object body. The green support body comprises granular construction material bound together by a binder. The method comprises supporting the green object body with the green support body. The method comprises sintering the green support body together with the green object body supported by the green support body. A method of manufacturing an object, a method of processing object data, a data carrier carrying program instructions and an object data processor are also provided.
BREAK AWAY SUPPORT FOR 3D PRINTING
In one example, a 3D printing system includes a support structure generator to identify a breakaway support to temporarily support part of the object, to design a wedge shaped groove between a portion of the object and the support, the groove ending at a line along which the support intersects the object, and to generate a digital object model that includes the support and the groove. The system also includes a 3D printer to print the object, support and groove based on the object model.
BREAK AWAY SUPPORT FOR 3D PRINTING
In one example, a 3D printing system includes a support structure generator to identify a breakaway support to temporarily support part of the object, to design a wedge shaped groove between a portion of the object and the support, the groove ending at a line along which the support intersects the object, and to generate a digital object model that includes the support and the groove. The system also includes a 3D printer to print the object, support and groove based on the object model.
Base plate in additive manufacturing
Assemblies fabricated by additive manufacturing include an object and a base plate providing support to the object during the manufacturing process. The geometry of the base plate is defined to optimize space and material constraints. During sintering, the base plate is reduced in area in a manner complementing the reduction in the footprint of the object, preserving the fidelity of the finished object.
Three-dimensional shaping method
A three-dimensional shaping method includes a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, a supporting step of supporting the molded body by a support having groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are inserted into the groove portions, and a sintering step of sintering the powder by heating the molded body in a state of being supported by the support, wherein the groove portion is extended from an insertion position of the projection portion in a specified direction that specifies a direction of shrinkage of the molded body by performing the sintering step.
Three-dimensional shaping method
A three-dimensional shaping method includes a molded body forming step of forming a molded body having a plurality of projection portions using a material containing a powder and a binder, a supporting step of supporting the molded body by a support having groove portions at positions configured to insert each of the projection portions in a state where the plurality of projection portions are inserted into the groove portions, and a sintering step of sintering the powder by heating the molded body in a state of being supported by the support, wherein the groove portion is extended from an insertion position of the projection portion in a specified direction that specifies a direction of shrinkage of the molded body by performing the sintering step.
Thin Sheet-Like Connecting Member and Manufacturing Method therefor, Semiconductor Device and Manufacturing Method therefor, and Power Conversion Device
A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.
Thin Sheet-Like Connecting Member and Manufacturing Method therefor, Semiconductor Device and Manufacturing Method therefor, and Power Conversion Device
A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.