Proposed is a three-dimensional chiral metal nanoparticle, comprising a heterometal nanoparticle including: a seed region formed of a first metal; and a heterogeneous region disposed on an external side of the seed region to enclose the seed region and formed of a second metal. The first metal is gold (Au), and the second metal is palladium (Pd). In a rectangular parallelepiped structure, a rectangular band shape rotates in a clockwise direction or a counterclockwise direction on each surface and protrudes towards a center of the surface.

Provided is a method for manufacturing material powder for metal laminating modelling, in which a virgin material is manufactured based on the particle size distribution of the virgin material being an unused material powder, and the fluidity of an unsintered reused material after the virgin material is reused a predetermined number of times by a metal laminating modelling device, so that the particle size distribution of the virgin material corresponds to the fluidity of the reused material that is equal to or greater than a predetermined standard value. Silica particles may be added to the virgin material.

A sintered friction material is formed by pressure sintering mixed powder at 800° C. or above, the mixed powder consisting of, in mass %, Cu and/or Cu alloy: 40.0 to 80.0%, Ni: 0% or more and less than 5.0%, Sn: 0 to 10.0%, Zn: 0 to 10.0%, VC: 0.5 to 5.0%, Fe and/or Fe alloy: 2.0 to 40.0%, lubricant: 5.0 to 30.0%, metal oxide and/or metal nitride: 1.5 to 30.0%, and the balance being impurity.

A method for manufacturing a coated metal powder includes: preparing a silanol solution in which a silicon-containing substance is dissolved in an alkaline aqueous solution; charging a metal powder into the silanol solution to obtain a dispersion; and forming a coating containing a silicon oxide on a particle surface of the metal powder by adding an acidic aqueous solution to the dispersion.

A powder material includes metal particles including an iron alloy and having an average particle diameter of 10 μm or larger and 500 μm or smaller, and nanoparticles including a metal or a metal compound and having undergone no surface treatment with an organic substance.

A silicon oxide-coated soft magnetic powder, in which the ratio of a volume-based cumulative 50% particle diameter D50 (HE) according to a dry laser diffraction particle size distribution analysis to the same particle diameter D50 (MT) according to a wet laser diffraction particle size distribution analysis is 0.7 or more, and a coverage ratio R defined by R=Si×100/(Si+M) (Si and M are molar fractions of Si and elements constituting the soft magnetic powder) is 70% or more is obtained by subjecting a slurry containing a soft magnetic powder containing 20 mass % or more of iron and a hydrolysate of a silicon alkoxide to a dispersion treatment when the surface of the soft magnetic powder is coated with the hydrolysate in a mixed solvent of water and an organic substance. The powder has good insulation/dispersibility properties and a high filling factor during molding.

The invention is related to a soft-magnetic powder comprising coated particles, the coated particles comprising a core and a shell, the core having an average particle size D.sub.50 in a range from 0.1 μm to 100 μm and comprising iron, wherein the shell has a thickness of not more than 20 nm and comprises at least two solid oxides and wherein the shell comprises at least three layers and the shell comprises more than one layers of a first solid oxide and at least one layer of a second solid oxide, wherein the more than one layers of the first solid oxide and the at least one layer of the second solid oxide are arranged in an alternating manner. The invention is further related to a process for the production of the soft-magnetic powder, a use of the soft-magnetic powder and an electronic component comprising the soft-magnetic powder.

An injection molding composition contains a titanium-based powder containing titanium as a main component and having an average particle diameter of 15 μm or more and 35 μm or less, a ceramic powder containing a ceramic as a main material and having an average particle diameter of 1 nm or more and 100 nm or less, and an organic binder. The ceramic is an oxide-based ceramic containing an oxide as a main component, and a standard free energy of formation of the oxide at 1000° C. may be lower than a standard free energy of formation of titanium oxide at 1000° C.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A method of manufacturing a composite material for thermal shields, and a composite material manufactured by the method are proposed. The method may include preparing a mixed powder including (i) a metal powder including a powder of aluminum or aluminum alloy and (ii) a polymer or ceramic powder. The method may also include sintering the mixed powder through pressureless sintering or spark plasma sintering to produce a composite material. According to the present disclosure, a powder of polymer, ceramic, and/or metal which have a relatively low level of thermal conductivity can be compounded with a metal material including aluminum through a sintering process of powder metallurgy, such as pressureless sintering or spark plasma sintering. Thus, a heterogeneous composite material with a low-level thermal conductivity (10 W/mk or less) can be obtained, and the composite material can be used as a material for various thermal shields.