A tungsten-carbide-based hard material includes the following components: tungsten carbide with an average particle size of 0.1-1.3 μm; 1.0-5.0 wt. % (Co+Ni), with a ratio of Co/(Co+Ni) in wt. % of 0.4≤Co/(Co+Ni)≤0.95; 0.1-1.0 wt. % Cr, with a ratio of Cr to (Co+Ni) in wt. % of 0.05 Cr/(Co+Ni) 0.20; 0.01-0.3 wt. % Mo; and 0.02-0.45 wt. % Me, where Me represents one or more elements from the group Ta, Nb, Hf and Ti, preferably Ta and/or Nb; and wherein 0.01≤Me/(Co+Ni)≤0.13.

The present invention relates to a method of making a cemented carbide comprising mixing in a slurry a first powder fraction and a second powder fraction, subjecting the slurry to milling, drying, pressing and sintering. The first powder fraction is made from cemented carbide scrap recycled using the Zn recovery process, comprising the elements W, C, Co, and at least one or more of Ta, Ti, Nb, Cr, Zr, Hf and Mo, and the second powder fraction comprising virgin raw materials of WC and possibly carbides and/or carbonitrides of one or more of Cr, Zr, W, Ta, Ti, Hf and Nb. The first powder fraction is subjected to a pre-milling step, prior to the step of forming the slurry, to obtain an average grain size of between 0.2 to 1.5 μm.

The present invention relates to a method of making a cemented carbide comprising mixing in a slurry a first powder fraction and a second powder fraction, subjecting the slurry to milling, drying, pressing and sintering. The first powder fraction is made from cemented carbide scrap recycled using the Zn recovery process, comprising the elements W, C, Co, and at least one or more of Ta, Ti, Nb, Cr, Zr, Hf and Mo, and the second powder fraction comprising virgin raw materials of WC and possibly carbides and/or carbonitrides of one or more of Cr, Zr, W, Ta, Ti, Hf and Nb. The first powder fraction is subjected to a pre-milling step, prior to the step of forming the slurry, to obtain an average grain size of between 0.2 to 1.5 μm.

A method for forming tungsten-refractory metal alloy powders, and tungsten-refractory metal alloy powders formed by the method. The method includes mixing a majority portion by weight of a base tungsten powder with a minority portion by weight of a base refractory metal powder to form a mixture, which is then milled for a period of time sufficient to at least partially mechanically alloy the base tungsten powder and base refractory metal powder together to form at-least-partially-mechanically-alloyed particles, which are then heat treated to a temperature sufficient to promote diffusion between tungsten and the refractory metal and obtain agglomerations of particles having only a tungsten phase, which are then milled to break up the agglomerations of particles and obtain the tungsten-refractory metal alloy powder.

The mechanical properties and thermal resistance of a sintered component made from an Al—Cu—Mg—Sn alloy powder metal mixture can be improved by doping the Al—Cu—Mg—Sn alloy powder metal mixture with a silicon addition. Silicon is added as a constituent to the Al—Cu—Mg—Sn alloy powder metal mixture. The Al—Cu—Mg—Sn alloy powder metal mixture is compacted to form a preform and the preform is sintered to form the sintered component.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

A multi-material structure includes a refractory portion with a metal or metal alloy of at least one of niobium (Nb), molybdenum (Mo), tantalum (Ta), tungsten (W), rhenium (Re), iridium (Ir), vanadium (V), and ruthenium (Ru). A structural portion is metallurgically joined with the refractory portion. The structural portion includes a titanium (Ti) alloy. At least one of the refractory and structural portions is additively manufactured.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.