Support substrates are used in certain additive fabrication processes to permit processing of an object. For additive fabrication processes with materials that are sintered into a final part, a multi-layer support substrate of interleaved support and interface layers is fabricated to support an object while reducing an impact of friction on shrinkage of the part during the sintering process.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A method of manufacturing a composite material for thermal shields, and a composite material manufactured by the method are proposed. The method may include preparing a mixed powder including (i) a metal powder including a powder of aluminum or aluminum alloy and (ii) a polymer or ceramic powder. The method may also include sintering the mixed powder through pressureless sintering or spark plasma sintering to produce a composite material. According to the present disclosure, a powder of polymer, ceramic, and/or metal which have a relatively low level of thermal conductivity can be compounded with a metal material including aluminum through a sintering process of powder metallurgy, such as pressureless sintering or spark plasma sintering. Thus, a heterogeneous composite material with a low-level thermal conductivity (10 W/mk or less) can be obtained, and the composite material can be used as a material for various thermal shields.

A method of manufacturing a composite material for thermal shields, and a composite material manufactured by the method are proposed. The method may include preparing a mixed powder including (i) a metal powder including a powder of aluminum or aluminum alloy and (ii) a polymer or ceramic powder. The method may also include sintering the mixed powder through pressureless sintering or spark plasma sintering to produce a composite material. According to the present disclosure, a powder of polymer, ceramic, and/or metal which have a relatively low level of thermal conductivity can be compounded with a metal material including aluminum through a sintering process of powder metallurgy, such as pressureless sintering or spark plasma sintering. Thus, a heterogeneous composite material with a low-level thermal conductivity (10 W/mk or less) can be obtained, and the composite material can be used as a material for various thermal shields.

The present invention provides an alloy, an alloy powder, an alloy member, and a composite member which are excellent in corrosion resistance and wear resistance, have crack resistance, and are suitable for an additive manufacturing method and the like. An alloy and an alloy powder include, by mass %, Cr: 18 to 22%, Mo: 18 to 28%, Ta: 1.5 to 57%, C: 1.0 to 2.5%, Nb: 0 to 42%, Ti: 0 to 15%, V: 0 to 27%, Zr: 0 to 29%, and a remainder consisting of Ni and unavoidable impurities, where a molar ratio of (Ta+0.7Nb+Ti+0.6V+Zr)/C=0.5 to 1.5 is satisfied. An alloy member is an additively manufactured product or a cast having such a solidification structure, and the solidification structure is a dendrite-like crystal structure having a metal phase having a face-centered cubic structure and carbides.

The present invention provides an alloy, an alloy powder, an alloy member, and a composite member which are excellent in corrosion resistance and wear resistance, have crack resistance, and are suitable for an additive manufacturing method and the like. An alloy and an alloy powder include, by mass %, Cr: 18 to 22%, Mo: 18 to 28%, Ta: 1.5 to 57%, C: 1.0 to 2.5%, Nb: 0 to 42%, Ti: 0 to 15%, V: 0 to 27%, Zr: 0 to 29%, and a remainder consisting of Ni and unavoidable impurities, where a molar ratio of (Ta+0.7Nb+Ti+0.6V+Zr)/C=0.5 to 1.5 is satisfied. An alloy member is an additively manufactured product or a cast having such a solidification structure, and the solidification structure is a dendrite-like crystal structure having a metal phase having a face-centered cubic structure and carbides.

A die having a cavity and a lower punch fitted into the cavity. The cavity is divided and the parts slide along a division plane passing through the cavity parallel to the fitting direction of the die and the lower punch. The divided cavity parts are placed in a state of alignment along the division plane. The divided cavity parts are each filled with raw material powder. The die and the lower punch are then slid along the division plane, whereby the divided cavity parts are combined as the original cavity. The raw material powder in the cavity in a combined state is compressed by an upper punch and the lower punch.

A die having a cavity and a lower punch fitted into the cavity. The cavity is divided and the parts slide along a division plane passing through the cavity parallel to the fitting direction of the die and the lower punch. The divided cavity parts are placed in a state of alignment along the division plane. The divided cavity parts are each filled with raw material powder. The die and the lower punch are then slid along the division plane, whereby the divided cavity parts are combined as the original cavity. The raw material powder in the cavity in a combined state is compressed by an upper punch and the lower punch.