A composite VC heat sink containing a copper/diamond composite wick structure and a method for preparing the same are provided. The VC heat sink includes a lower shell plate. The lower shell plate is provided with a recess at a center position of an inner surface and provided with a boss with a same plane size as the recess at a center position of an outer surface, and a surface of the boss or a surface of the recess is provided with a copper/diamond composite plate. The copper/diamond composite wick structure has a three-dimensional porous structure and uses a copper/diamond sintered body as a matrix, a surface of the matrix is provided with a diamond layer, and a surface of the diamond layer is provided with a metal hydrophilic layer. The heat dissipation performance of the composite VC heat sink is maximized under the cooperation of structure and materials.

A polycrystalline diamond construction has a body of polycrystalline diamond (PCD) material; and a cemented carbide substrate bonded to the body of polycrystalline material along an interface. The cemented carbide substrate has tungsten carbide particles bonded together by a binder material, the binder material comprising Co; and the tungsten carbide particles form at least around 70 weight percent and at most around 95 weight percent of the substrate. The cemented carbide substrate has a bulk volume, the bulk volume of the cemented carbide substrate having at least around 0.1 vol. % of inclusions of free carbon having a largest average size in any one or more dimensions of less than around 40 microns.

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 μm or less; a silver powder having a median diameter D50 of 25 μm or more; and a solvent, wherein the content of the flake-like silver powder is 15 to 70 parts by mass and the content of the silver powder having a median diameter D50 of 25 μm or more is 30 to 85 parts by mass based on 100 parts by mass in total of the flake-like silver powder and the silver powder having a median diameter D50 of 25 μm or more.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

Valves and valve assemblies are described herein employing architectures which can mitigate degradative wear mechanisms, thereby prolonging life of the assembly. In one aspect, a valve comprises a head including a circumferential surface and a valve seat mating surface comprising sintered cemented carbide. Leg members extend from the head, wherein thickness of one or more of the leg members tapers in a direction away from the head to induce laminar fluid flow around the head. In some embodiments, the sintered cemented carbide is an inlay coupled to the valve head.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.

This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.

This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.

A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.