A motorized drapery system having an elongated rotating drive element that has a non-circular cross-sectional shape such as square, rectangular, trapezoidal, cross shaped or any other non-circular shape that is twisted. In one arrangement the drive element is twisted in one direction along its entire length. In another arrangement the drive element is twisted in one direction in a first section and twisted in an opposite direction in a second section thereby providing a center opening/center closing drapery. A plurality of rings are positioned around the drive element including at least one driver ring that includes a feature that connects to the drive element and is configured to facilitate movement along the drive element, and a plurality of idler rings that are configured to slide along the drive element. A curtain is connected to the rings and opens and closes as the rings move along the drive element.

Described herein is a first method of forming a hole in a workpiece, having a first surface and a second surface opposite the first surface. The method includes forming a first hole, having a first diameter, in the workpiece by passing a first cutter through the workpiece from the first surface to the second surface. Additionally, the method includes forming a chamfer in the second surface of the workpiece concentric with the first hole using a second cutter. The chamfer has a second diameter larger than the first diameter. The method further includes forming a second hole, having a third diameter larger than the first diameter, in the workpiece concentric with the first hole by passing a third cutter through the workpiece from the first surface to the second surface.

A combination cutting and burnishing orbital drilling tool may include an elongate tool body including a cutting end and extending along a longitudinal axis. The tool body may include a burnishing portion spaced from the cutting end and configured to induce residual stress in a side wall of a hole without removing material. The tool body may further include a cutting portion interposed between the cutting end and the burnishing portion. The cutting portion may be configured to remove material from a workpiece, thereby creating the hole, during an orbital drilling process.

A turning tool for internal turning of a metal work piece having a rear end, an opposite forward end and a longitudinal center axis extending therebetween. The first nose cutting edge includes a first radially distal point having an associated first rake face and separates and connects a first forward cutting edge and a first rearward cutting edge. A second nose cutting edge of the turning tool includes a second radially distal point having an associated second rake face and separates and connects a second forward cutting edge and a second rearward cutting edge. The second radially distal point is positioned ahead of the first radially distal point. The first forward cutting edge forms an acute first entering angle, the second forward cutting edge forms an obtuse second back clearance angle, and the second rearward cutting edge forms an acute second entering angle.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

A peeling plate has upper and lower sides, lateral faces extending between the upper and lower sides, and primary and secondary cutting edges at the transition from the lateral faces to the upper side. The peeling plate in a plan view of the upper side has the shape of a substantially regular n-gon, n being five or six, and n lateral edges lying between the n lateral faces. A primary cutting edge and a secondary cutting edge are formed at the transition from at least one lateral face to the upper surface, wherein active primary cutting edges and active secondary cutting edges are spaced apart from a lateral edge. The lateral edge at the transition to the upper side forming an active cutting corner to the respective active primary cutting edge and active secondary cutting edge.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 .Math.in.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

Methods and apparatus for forming holes through a substrate are provided herein. In some embodiments, a method of forming holes in a substrate for use in a process chamber includes: partially forming the plurality of holes in a substrate using a first drill to form a plurality of rough holes through the substrate from a first side of the substrate to an opposite second side of the substrate; positioning the substrate between a second drill and a third drill; using the second drill to finish the plurality of rough holes from the first side of the substrate to a first location at least halfway along the length of each hole of the plurality of rough holes; and using the third drill to finish the plurality of rough holes from the second side of the substrate to at least the first location along the length of each hole of the plurality of rough holes.