A coated tool, such as a rotating, cutting tool, includes a tool body and a multilayer wear protection coating system. The wear protection system coats a functional surface of the tool body that is subject to wear and includes a first undoped diamond layer and a second undoped diamond layer disposed over the first undoped diamond layer. The first undoped diamond layer is electrically conductive and exhibits grain boundary conductivity from delocalized electrons. The second undoped diamond layer is electrically insulating. The first undoped diamond layer is 4-20 microns thick and is made with diamond grains whose size ranges from 4-10 nm. The first and second diamond layers are applied by chemical vapor deposition (CVD) using a hot-wire method. The wear protection system also includes an additional undoped diamond layer that is electrically insulating and is disposed between the functional surface of the tool body and the first diamond layer.

A coated cutting tool for chip forming machining of metals includes a substrate having a surface coated with a chemical vapour deposition (CVD) coating. The coated cutting tool has a substrate coated with a coating including a layer of α-Al2O3, wherein the α-Al2O3 layer exhibits a dielectric loss of 10−6≦tan δ≦0.0025, as measured with AC at 10 kHz, 100 mV at room temperature of 20° C.

A surface-coated cutting tool with a hard coating layer is provided. The hard coating layer includes at least a complex nitride or carbonitride layer (2) expressed by a composition formula: (Ti.sub.1-x-yAl.sub.xMe.sub.y)(C.sub.zN.sub.1-z), Me being an element selected from Si, Zr, B, V, and Cr. The average content ratio X.sub.avg, the average content ratio Y.sub.avg, and the average content ratio Z.sub.avg satisfy 0.60≦X.sub.avg, 0.005≦Y.sub.avg≦0.10, 0≦Z.sub.avg≦0.005, and 0.605≦x.sub.avg+y.sub.avg≦0.95. There are crystal grains having a cubic structure in the crystal grains constituting the complex nitride or carbonitride layer (2). A predetermined periodic content ratio change of Ti, Al and Me exists in the crystal grains having the cubic structure.

A composite sintered body cutting tool is made of a composite sintered body comprising a TiCN-based cermet layer; and a WC-based cemented carbide layer. The angle between the rake face and the flank face of the cutting tool is 90°. The rake face including a cutting edge of the cutting tool is constituted from the WC-based cemented carbide layer, in which 4 to 17 mass % of an iron group metal component and 75 mass % or more of W are included; and a major hard phase component is WC. The thickness of the WC-based cemented carbide layer is 0.05 to 0.3 times the thickness of the composite sintered body. The TiCN-based cermet layer is constituted from a single layer of a TiCN-based cermet layer, including at least, 4 to 25 mass % of an iron group metal component, less than 15 mass % of W, 2 to 15 mass % of Mo, 2 to 10 mass % of Nb and 0.2 to 2 mass % of Cr in a case where contents of the constituting components of the cermet layer are expressed as contents of metal components, and satisfy the Co content relative to the total content of Co and Ni of 0.5 to 0.8 with respect to Co and Ni of the iron group metal component in a mass ratio. When the height profile from the upper end to the lower end of the flank face is measured in the plane, which passes the center of the rake face of the cutting tool and is perpendicular to both of the rake face and the flank face, as the line, which passes the ridge line where the rake face and the flank face intersect and perpendicular to the rake face, being the reference line, the maximum elevation difference value of the height profile is in a ratio of 0.01 or less with respect to the thickness of the composite sintered body from the front surface of the rake face to a rear surface.

The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

A drill bit stabilizer and a method of drilling holes through work surfaces. The drill bit stabilizer includes an adhesive strip with a drill guide hole portion extending outwardly therefrom. The adhesive strip with the drill guide hole portion is preferably transparent and portable for placement on a surface through which a hole is to be drilled. The method includes the steps of providing an adhesive strip with a drill guide hole portion extending therefrom; positioning the adhesive strip on a surface; releasably mounting the adhesive strip to the surface; inserting a drill bit attached to a drill motor into the drill guide hole portion; drilling a hole through the drill guide hole portion and into the surface beneath it; and removing the adhesive strip from the surface after the hole has been drilled.

Disclosed are rare earth metal containing silicate coatings, coated articles (e.g., heaters and susceptors) or bodies of articles and methods of coating such articles with a rare earth metal containing silicate coating.

In a surface-coated cutting tool in which a hard coating layer having a total layer thickness of 0.5 to 10 μm is deposited on a surface of a tool body made of WC-based cemented carbide or TiCN-based cermet, the hard coating layer has an alternately laminated structure of A layers and B layers, in a case where the A layer is: (Al.sub.aTi.sub.1-a)N (here, a is in atomic ratio), the A layer satisfies 0.50≦a<0.75, in a case where the B layer is: (Al.sub.bTi.sub.1-b)N (here, b is in atomic ratio), the B layer satisfies 0.75≦b≦0.95, and when a layer thickness per layer of the A layers is represented by x (nm) and a layer thickness per layer of the B layers is represented by y (nm), 5y≧x≧3y and 250 (nm)≧x+y≧100 (nm) are satisfied.

A cutting tool comprises a base material which includes particles including a tungsten carbide (WC) as a main component, a binder phase including cobalt (Co) as a main component, and particles including a carbide or a carbonitride of at least one selected from the group consisting of Group 4a, 5a, and 6a elements, or a solid solution thereof; and a hard film formed on the base material, wherein the hard film comprises at least an alumina layer, a cubic phase free layer (CFL), in which the carbide or the carbonitride is not formed, is formed from a surface of the base material to a depth of 10 μm to 50 μm, and a Co content of a surface of the CFL is 80% or more of a maximum Co content of the CFL.

A coated tool is, for example, a cutting tool which is provided with a base material and a coating layer located on the base material, wherein a cutting edge and a flank surface are located on the coating layer, the coating layer has a portion in which at least a titanium carbonitride layer and an aluminum oxide layer having an a-type crystal structure are laminated in this order, and, with regard to a texture coefficient (Tc) (hkl) which is calculated on a basis of a peak of the aluminum oxide layer analyzed by an X-ray diffraction analysis, a texture coefficient (Tc1) (146) as measured from a surface side of the aluminum oxide layer in the flank surface is 1 or more.