A blade changer unit includes a blade chuck for holding a cutting blade, a moving unit for moving the blade chuck, and a control unit for controlling moving unit. The blade chuck has a plurality of electrically conductive grippers for holding the cutting blade. The controller detects conduction between the grippers and a boss. The control unit includes a calculator for calculating the position of a central axis of the mount from coordinates where the conduction between the holder and the boss is detected when the moving unit is controlled to bring the grippers into contact with the mount at at least three points, and a mounting/dismounting controller for mounting and dismounting the cutting blade while the central axis of the blade chuck is aligned with the central axis of the mount calculated by the calculator.

A blade holding jig for holding a washer-type cutting blade via an annular retainer flange includes an annular flange holding portion configured to hold a first annular surface of the retainer flange under suction, and an annular non-contact suction portion arranged on an outer peripheral portion of the flange holding portion and configured to produce a negative pressure by ejection of a fluid toward the outer peripheral portion of the retainer flange held by the flange holding portion and to draw up the cutting blade toward the retainer flange. The cutting blade drawn up toward the retainer flange by the non-contact suction portion is held on the retainer flange by a suction force acting from the flange holding portion via a plurality of through holes disposed extending from a second annular surface to the first annular surface of the retainer flange.

A laser beam applying unit of a laser processing apparatus includes a beam splitter disposed on a first optical path connecting a laser oscillator and a condenser, a wide band light source disposed on a second optical path branched by the beam splitter, a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third optical path, and a Z position detection unit that is disposed on the third optical path branched by the spectroscope and that detects the position in a Z-axis direction of a workpiece according to an intensity of light corresponding to the wavelength of return light that is generated when the light of the wide band light source is condensed by the condenser and is reflected by the workpiece held by a chuck table.

A method for finishing a glass or ceramic article includes applying a force to the glass or ceramic article. The force is applied to the glass or ceramic article at least when the glass or ceramic article is at a temperature that is greater than or equal to a creep temperature of the glass or ceramic article. Holding the force to the glass or ceramic article as the glass or ceramic article is cooled to a temperature that is less than the creep temperature of the glass or ceramic article.

An adaptive precision chuck for a precision/ultraprecision machining system is described. The chuck (200) defining a mount for receiving a workpiece (300) wherein, when in use, the centre of the mount is configured to be substantially concentric with an axis of rotation (214) of the machining system, the chuck (200) further including jaws (210) about the mount and a plurality of compliant flexures (203-206) configured, upon application of rotational forces by the machining system to the chuck about the axis of rotation (214), to engage the jaws (210) upon a workpiece (300) in the mount.

An end effector comprises a plurality of vacuum ports. The plurality of vacuum ports is formed from a plurality of hollow protrusions extending from a face of the end effector. The plurality of vacuum ports is connected to a vacuum chamber receiving a vacuum from a vacuum source interface.

An expander unit of a cryogenic refrigerator device includes a moving assembly with a porous regenerative heat exchanger configured to move back and forth along a longitudinal axis. A magnetic spring assembly includes a stationary magnetic assembly fixed to the cold finger base that includes one or more magnetic rings fixedly arranged about a bore. A movable magnetic assembly includes one or more movable magnetic rings fixed to the moving assembly. An outer lateral dimension of each of the movable magnetic rings is less than an inner lateral dimension of the bore. The stationary magnetic assembly and the movable magnetic assembly are configured such that, when the moving assembly is displaced along the longitudinal axis from an equilibrium position, attractive and repulsive forces between the movable magnetic assembly and the stationary magnetic assembly yield a restoring force that is directed to restore the moving assembly to the equilibrium position.

Disclosed is an apparatus for supporting a substrate. The substrate support unit includes a support plate having a plurality of absorption holes, in which a vacuum pressure is formed, on an upper surface thereof to absorb the substrate, and a vacuum absorption unit configured to apply the vacuum pressure to the absorption holes, and the vacuum absorption unit includes a pressure measuring member configured to measure internal pressures of the absorption holes, an intake unit configured to intake and discharge gas in the absorption holes and adjust a suction force for suctioning the gas in the absorption holes, and a controller configured to control the intake unit to adjust the suction force according to the internal pressures measured by the pressure measuring member.

A vacuum chuck includes an adsorption plate including porous materials, a housing including an accommodation part, a plurality of adsorption grooves, and a vacuum opening formed in the accommodation part. The adsorption plate is disposed in the accommodation part, and the plurality of adsorption grooves each have an arc shape and is formed in a surface of the accommodation part. The vacuum chuck further includes a vacuum line configured to supply vacuum pressure to the vacuum opening.

A specialized vacuum chuck system of the present invention is capable of securing an object to a specialized welding tool in order to ensure that the object remains in a proper positional relationship with the welding tool. The system may also use springs and load stops to ensure that a proper load in maintained so the chuck base is not pulled off the object.