B23D61/021

TIP SAW FOR COMPOSITE MATERIAL
20180001402 · 2018-01-04 · ·

Provided is a tip saw which is provided with saw blades formed at a predetermined interval on an outer periphery of a disk-shaped base metal and a tip securely attached to a base formed on each saw blade, in which flank faces and rake faces of the tips are set in a staggered manner, and the rake faces are provided at a negative angle of inclination in a direction opposite to a rotation direction of said tip saw, and when a workpiece material is thin-walled, the tips are in substantially fan shapes, and adjacent saw blades have a pitch of less than 3.5 mm or less than 3.0 mm therebetween.

TIP SAW
20230211428 · 2023-07-06 ·

A tip saw has disk-shaped and comprises cutting blade pieces, support pieces, and a base metal. The cutting blade pieces are disposed at blade edges of the tip saw. The support pieces are disposed between adjoining two of the cutting blade pieces. The cutting blade pieces and the support pieces are configured to be thicker than a thickness D1 of the base metal of the tip saw (D2>D1). The support pieces have a thickness equal to or nearly equal to the thickness D2 of the cutting blade pieces (D3=D2 or D3≈D2). Consequently, the width of a cut groove Pc formed on a work material by the cutting blade pieces can be maintained wider than the thickness D1 of the base metal of the tip saw by the support pieces without increasing the number of the cutting blade pieces of the tip saw.

Methods for edge trimming of semiconductor wafers and related apparatus
11538711 · 2022-12-27 · ·

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Circular saw blade

A circular saw blade includes a plurality of cutting teeth repeatedly alternating between a first set of cutting teeth and a second set of cutting teeth around the periphery of the saw blade. Each first set of cutting teeth includes at least two efficient cutting teeth, each second set of cutting teeth comprising at least one robust cutting tooth. Each first set of teeth and each second set of teeth are configured such that, if one tooth in the first set of teeth breaks, the chip load in the immediately following second set of teeth increases by less than approximately 45%.

CIRCULAR SAW BLADE
20230084067 · 2023-03-16 ·

A circular saw blade includes a plurality of cutting teeth repeatedly alternating between a first set of cutting teeth and a second set of cutting teeth around the periphery of the saw blade. Each first set of cutting teeth includes at least two efficient cutting teeth, each second set of cutting teeth comprising at least ne robust cutting tooth. Each first set of teeth and each second set of teeth are configured such that, if one tooth in the first set of teeth breaks, the chip load in the immediately following second set of teeth increases by less than approximately 45%.

CIRCULAR SAW BLADE
20230083825 · 2023-03-16 ·

A circular saw blade comprising: a rigid central disk that is provided with a central pass-through hole adapted to be engaged by the machine-tool spindle; and a series of teeth that jut out from the periphery of the rigid central disk in a substantially radial direction, are suitably spaced along the periphery of the rigid central disk and have, on their front edge, a cutting insert; at least one of said teeth being provided with a plate-like protruding ridge or appendage that projects from the back of the tooth, towards the cutting insert of the following tooth, and is tapered towards its distal end; said protruding appendage and the front edge of the following tooth being shaped so as to form a substantially circular-shaped gullet in front of the following tooth.

APPARATUS FOR EDGE TRIMMING OF SEMICONDUCTOR WAFERS
20230105086 · 2023-04-06 ·

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Segmented cutting type tipped saw blade

A segmented cutting type tipped saw blade includes a first ridge tip, a second ridge tip, a first end tip, and a second end tip. A first end of the first end tip, a second end of the second end tip, a tip end of the first ridge tip, and a tip end of the second ridge tip project radially outward. A top bevel surface extending from the first end and a top bevel surface extending from the second end, a first bevel surface and a second bevel surface extending from the tip end of the first ridge tip and a first bevel surface and a second bevel surface extending from the tip end of the second ridge tip each have a top bevel angle of greater than or equal to 3° and less than or equal to 10°.

Asphalt saw blade

A unique design is provided that increases the strength and extends the life of an asphalt saw blade. The asphalt saw blade may include a main body, outer plates and cutters that are secured to the main body and outer plates via a notched interface. The cutters can include cutting elements and a plate that reinforces the cutting elements while also shielding the cutter's main body from wear.

ASPHALT SAW BLADE
20220032383 · 2022-02-03 ·

A unique design is provided that increases the strength and extends the life of an asphalt saw blade. The asphalt saw blade may include a main body, outer plates and cutters that are secured to the main body and outer plates via a notched interface. The cutters can include cutting elements and a plate that reinforces the cutting elements while also shielding the cutter's main body from wear.